Effect of Ga on the Inoxidizability and Wettability of Sn-0.5Ag-0.7Cu-0.05Pr Solder

Abstract

The effect of trace amount of Ga on the inoxidizability and wettability of Sn-0.5Ag-0.7Cu-0.05Pr solders was investigated systematically by means of microstructure characterizations. The results indicate that the wettability and oxidation resistance properties are remarkably improved with addition of trace amount of Ga. Moreover, it is observed that the trace amount of Ga in Sn-0.5Ag-0.7Cu-0.05Pr solders refines the matrix microstructure. The relationship between wettability and oxidation resistance was put into deep study. And Ga was found to be enriched on the surface of the molten solder, which benefited the properties correspondingly. The results of this study can stimulate the use of low-silver Sn-Ag-Cu-Pr solders for various applications.