Effect of Graphene Nanoplatelets on Wetting, Microstructure, and Tensile Characteristics of Sn-3.0Ag-0.5Cu (SAC) Alloy

Sharma, Ashutosh; Sohn, Heung-Rak; Jung, Jae Pil

doi:10.1007/s11661-015-3214-8

Cited by 60 publications

(58 citation statements)

References 32 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…In recent years, among lead‐free solders, Sn‐based fillers have attracted great interest for their low cost and nontoxic . Sn‐based filler have obtained connected joints in brazing alumina, graphite, SiO 2 to themselves or to metals .…”

Section: Introductionmentioning

confidence: 99%

Effect of Ti addition on the wetting and brazing of Sn0.3Ag0.7Cu filler on SiC ceramic

Song

et al. 2018

J Am Ceram Soc

View full text Add to dashboard Cite

The wetting behavior of Sn0.3Ag0.7Cu (SAC) filler with the addition of Ti on SiC ceramic was investigated using sessile drop method. SiC/SiC was brazed by SAC‐Ti filler with different Ti content at 1223 K (950°C) for 10 minutes. The wettability of SAC‐Ti filler on SiC was significantly enhanced with the addition of Ti. The contact angle decreased at first and then increased with increasing Ti content. The lowest contact angle of 9° was obtained with SAC‐1.5Ti (wt%) filler. When Ti content further increased to 2.0 wt%, the contact angle increased, due to the intense reaction of Ti–Sn. The reaction between Ti and SiC controlled the wetting behavior of SAC‐Ti on the SiC substrate and the reaction products such as TiC and Ti5Si3 were formed. The wetting of SAC‐Ti on SiC was reaction‐controlled. Interfacial reaction products TiC and Ti5Si3 were observed. The wetting activation energy in spreading stage was calculated to be 129.3 kJ/mol. Completely filled SiC/SiC joints were obtained using the filler with Ti content higher than 0.5 wt%. The fillet height increased firstly then decreased with mounting Ti content. The shear strength of joints increased first with the addition of Ti then decreased with Ti content increasing to 2.0 wt%. The highest shear strength of 35.7 MPa was obtained with SAC‐1.5 Ti (wt%) filler.

show abstract

Section: Introductionmentioning

confidence: 99%

Effect of Ti addition on the wetting and brazing of Sn0.3Ag0.7Cu filler on SiC ceramic

Song

et al. 2018

J Am Ceram Soc

View full text Add to dashboard Cite

show abstract

“…Secondly, it is an environmentally benign and safe technique as compared to chemical routes (solution precipitation, plating, chemical vapor deposition) where toxic waste disposal and drainage costs are added up [17][18][19]. In addition, high-energy ball milling is a simple and effective way to produce novel nanostructured materials, homogeneous chemical distribution, and extension of solid solubility and widens the scope of HEA [34][35][36][37][38][39][40]. Further densification of milled powders by heat treatment, hotpressing, cold isostatic pressing, or spark plasma sintering (SPS) technique gives the stable bulk HEA.…”

Section: Fillers Processed By Powder Technologymentioning

confidence: 99%

High-Entropy Alloys for Micro- and Nanojoining Applications

Sharma¹

2020

Engineering Steels and High Entropy-Alloys

Self Cite

View full text Add to dashboard Cite

The aim of this chapter is to provide a basic understanding of the metal-ceramic joints and high-entropy alloy (HEA) research in microjoining applications. We will first overview the issues in metal-ceramic brazing and solutions to overcome those issues using various fillers. Various approaches are available for joining ceramic to metallic materials. One approach will be to look for brazing alloys with the so-called high-entropy characteristics which exhibit a solid solution phase. The conventional alloy design and arc melting, Bridgman solidification, and advanced powder metallurgy techniques will be studied, including high-energy ball milling (HEBM) for the mechanical alloying process, and hot-press and spark plasma sintering (SPS) techniques are utilized for improved densification and phase transformation. We also summarize the various thermodynamic relations to obtain the high-entropy phase and present future possibilities of high-entropy alloys in microjoining research at the later stage of this chapter.

show abstract

“…Appropriate content of GNSs can significantly increase the spreading area of SnAgCu solder; however, when the content exceeds 0.1 wt.%, GNSs tend to agglomerate and float onto the top of the molten solder and, hence, the wettability of the composite solder decreases [40]. Appropriate content of GNSs can significantly increase the spreading area of SnAgCu solder; however, when the content exceeds 0.1 wt.%, GNSs tend to agglomerate and float onto the top of the molten solder and, hence, the wettability of the composite solder decreases [40].…”

Section: Wettabilitymentioning

confidence: 99%

Effect of Nanoparticles Addition on the Microstructure and Properties of Lead-Free Solders: A Review

et al. 2019

View full text Add to dashboard Cite

With the development of microelectronic packaging and increasingly specific service environment of solder joints, much stricter requirements have been placed on the properties of lead-free solders. On account of small size effect and high surface energy, nanoparticles have been widely used to improve the microstructure and properties of lead-free solders. Therefore, the composite solders bearing nanoparticles have recently attracted wide attention. This article reviewed the recent research on SnAgCu, SnBi, and SnZn composite solder alloys and introduced the effect of nanoparticles on their microstructure, mechanical properties, wettability, and reliability. The mechanism of nanoparticles strengthening was analyzed and summarized. In addition, the shortcomings and future development trends of nanoparticle-reinforced lead-free solders were discussed, which is expected to provide some theoretical reference for the application of these composite solder in 3D IC package.

show abstract

Effect of Graphene Nanoplatelets on Wetting, Microstructure, and Tensile Characteristics of Sn-3.0Ag-0.5Cu (SAC) Alloy

Cited by 60 publications

References 32 publications

Effect of Ti addition on the wetting and brazing of Sn0.3Ag0.7Cu filler on SiC ceramic

Effect of Ti addition on the wetting and brazing of Sn0.3Ag0.7Cu filler on SiC ceramic

High-Entropy Alloys for Micro- and Nanojoining Applications

Effect of Nanoparticles Addition on the Microstructure and Properties of Lead-Free Solders: A Review

Contact Info

Product

Resources

About