2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) 2018
DOI: 10.1109/itherm.2018.8419624
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Effect of Green EMCs on Fatigue Reliability of Molded Cu Wirebond System

Pradeep Lall
1
,
Shantanu Deshpande
2
,
Nakul Kothari
3
et al.
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Cited by 5 publications
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References 17 publications
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Stress Strain Analysis on Stitch Bond of Cu-Al Wirebonds Using X-ray Micro-CT Technique

Lall1,
Kasturi2,
Suhling3
et al. 2019
2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
8
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0
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Stress Strain Analysis on Stitch Bond of Cu-Al Wirebonds Using X-ray Micro-CT Technique

Lall1,
Kasturi2,
Suhling3
et al. 2019
2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
8
0
0
0
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Effect of Long Term Isothermal Exposure on Underfill Material Properties

Lall
1
,
Kasturi
2
,
Wu
3
et al. 2020
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
11
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1
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Evolution of Viscoelastic Properties of Underfills Exposed to High Temperature

Lall
1
,
Kasturi
2
,
Wu
3
et al. 2021
2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
7
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