Effect of iron and indium on IMC formation and mechanical properties of lead-free solder

Thermal property, wettability and interfacial characterization of novel Sn–Zn–Bi–In alloys as low-temperature lead-free solders

“…Thus, the addition of indium further lowers the melting temperature of Sn-Zn-Bi solder and makes it rather closer to that of Sn-37Pb. Similar results, demonstrating the effect of In addition on the thermal properties of Sn-Ag-Cu and Sn-CuNi solder alloys have been reported [14,15,17].…”

Thermal and mechanical properties of lead-free SnZn–xNa casting alloys, and interfacial chemistry on Cu substrates during the soldering process

“…Reducing the CTE of the solder improved the resistance to thermomechanical fatigue. This is because it reduced thermal or residual stress, one of the causes of fatigue [40]. The CTE mismatch between packaging materials may lead to various types of failure during manufacturing processes [40].…”

“…This is because it reduced thermal or residual stress, one of the causes of fatigue [40]. The CTE mismatch between packaging materials may lead to various types of failure during manufacturing processes [40]. Reducing CTE could also increase the shear strength, as a result of microstructure refinement [40].…”

Utilization of a Porous Cu Interlayer for the Enhancement of Pb-Free Sn-3.0Ag-0.5Cu Solder Joint

“…The elements of the selected surface are listed in Table 4, together with their respective phases as identified according to the Sn-Cu phase diagram [31]. Basically, the Cu atoms of IMC phase migrated from SAC305 solder alloy and the Cu substrate to form Cu 6 Sn 5 phase joining interface [32,33]. As seen in Figure 11a-c, the growth of an elongated scallop-liked layer of Cu 6 Sn 5 phase at SAC305/Cu substrate interface was observed for the sample soldered at 307 • C and 300 s with and without the addition of porous Cu.…”