2022
DOI: 10.1007/s11837-021-05146-3
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Effect of Low Bi Content on Reliability of Sn-Bi Alloy Joints Before and After Thermal Aging

Abstract: Sn-58Bi, an eutectic alloy, has been explored for use as a low-temperature lead-free solder alloy. However, the properties of Sn-Bi alloys as well as those of their joints need to be improved significantly so that these alloys can be applicable for practical use. In particular, two drawbacks need to be addressed: the intrinsic brittleness of Bi and the microstructure coarsening of these alloys during aging. In this study, Sn-Bi-Zn (SBZ) and SBZ-In (SBZI) alloys with low Bi contents were examined to elucidate t… Show more

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Cited by 7 publications
(2 citation statements)
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“…The greater the energy, the faster the insulation deterioration rate. Therefore, the variation trend of the partial discharge pulse power with the applied voltage amplitude shows that the deterioration rate of the turn-to-turn insulation of the model sample increases with the increase of the applied voltage amplitude [20][21][22][23].…”
mentioning
confidence: 88%
“…The greater the energy, the faster the insulation deterioration rate. Therefore, the variation trend of the partial discharge pulse power with the applied voltage amplitude shows that the deterioration rate of the turn-to-turn insulation of the model sample increases with the increase of the applied voltage amplitude [20][21][22][23].…”
mentioning
confidence: 88%
“…In this case, it is not necessary to solder the busbar manually or automatically, but the busbar can only be secured on the PVB foil using acrylic glue and the activation will take place within the autoclave cycle (Nishikawa et al, 2022). Subsequently, the use of Bi 57 -In 26 -Sn 17 bismuth-indium-tin solder is suggested Fig.…”
Section: Introductionmentioning
confidence: 99%