To achieve both the synergistic advantages
of outstanding flexibility
in organic dielectrics and remarkable dielectric/insulating properties
in inorganic dielectrics, a plasma-polymerized hafnium oxide (HfO
x
) hybrid (PPH-hybrid) dielectric is proposed.
Using a radio-frequency magnetron cosputtering process, the high-k HfO
x
dielectric is plasma-polymerized
with polytetrafluoroethylene (PTFE), which is a flexible, thermally
stable, and hydrophobic fluoropolymer dielectric. The PPH-hybrid dielectric
with a high dielectric constant of 14.17 exhibits excellent flexibility,
maintaining a leakage current density of ∼10–8 A/cm2 even after repetitive bending stress (up to 10000
bending cycles with a radius of 2 mm), whereas the HfO
x
dielectric degrades to be leaky. To evaluate its
practical applicability to flexible thin-film transistors (TFTs),
the PPH-hybrid dielectric is applied to amorphous indium–gallium–zinc
oxide (IGZO) TFTs as a gate dielectric. Consequently, the PPH-hybrid
dielectric-based IGZO TFTs exhibit stable electrical performance under
the same harsh bending cycles: a field-effect mobility of 16.99 cm2/(V s), an on/off current ratio of 1.15 × 108, a subthreshold swing of 0.35 V/dec, and a threshold voltage of
0.96 V (averaged in nine devices). Moreover, the PPH-hybrid dielectric-based
IGZO TFTs exhibit a reduced I–V hysteresis and an enhanced positive bias stress stability, with
the threshold voltage shift decreasing from 4.99 to 1.74 V, due to
fluorine incorporation. These results demonstrate that PTFE improves
both the mechanical durability and electrical stability, indicating
that the PPH-hybrid dielectric is a promising candidate for high-performance
and low-power flexible electronics.