Effect of microstructural features on the thermal conducting behavior of carbon nanofiber–reinforced styrene-based shape memory polymer composites

Abstract

This article presents a novel hierarchical micromechanics approach to carefully investigate the thermal conductivities of styrene-based shape memory polymer composites containing carbon nanofibers. The research is mainly focused on the simulation of carbon nanofiber/shape memory polymer interfacial thermal resistance and carbon nanofiber agglomeration as two critical microstructural features of carbon nanofiber–shape memory polymer composite materials. The computed results are compared with the available experimental measurements. It is found that both of those microstructural factors along with carbon nanofiber non-straight shape significantly affecting the thermal conducting behavior must be incorporated in the analysis to have a more realistic prediction. The thermal conductivity of carbon nanofiber–reinforced shape memory polymer composites reduces significantly due to the effects of carbon nanofiber/shape memory polymer interfacial resistance and carbon nanofiber agglomeration and waviness. It is suggested to uniformly disperse carbon nanofibers into the shape memory polymers and reduce interfacial resistance for improving the carbon nanofiber–styrene composite thermal properties. In addition, the present study reveals that the effective thermal conductivities of the shape memory polymer composites reinforced by aligned carbon nanofibers are greatly enhanced over those of the shape memory polymer composites containing randomly dispersed carbon nanofibers. The effects of percentage, waviness parameters, degree of agglomeration, material properties, length and diameter of carbon nanofibers as well as interfacial thermal resistance value on the thermal behavior of carbon nanofiber–reinforced styrene-based shape memory polymer composites are investigated.

A Novel Microscopic Modeling Scheme for the Shape Memory Polymer Composites with respect to the Ambient Temperature

“…By choosing a cylindrical representative volume element (RVE), Khalili et al [29] evaluated the interface property influences on mechanical behaviors of the SMPC. Liu and Jiang [30] presented a novel hierarchical micromechanic method to study the microstructural feature influences on the thermal conducting behavior of the SMPC. However, few studies refer to random inclusions in the matrix materials.…”