Effect of Ni and Pd Addition on Mechanical, Thermodynamic, and Electronic Properties of AuSn4-Based Intermetallics: A Density Functional Investigation

Tian, Yanhong; Zhou, Wei; Wu, Peng

doi:10.1007/s11664-016-4592-4

Cited by 7 publications

(4 citation statements)

References 35 publications

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“…There is one theoretical report available in the literature that suggests AuSn 4 to be a HSPSM, that too in a catalogue of topological materials. Other first principle study of AuSn 4 , is done for physical properties like mechanical and thermal properties [40]. The system AuSn 4 , lacks a dedicated theoretical study on its topological properties and the same is warranted in [41].…”

Section: Introductionmentioning

confidence: 99%

Non-trivial band topology in the superconductor AuSn₄: a first principle study

Karn

Sharma

Awana

2022

Supercond. Sci. Technol.

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Topological semimetals such as Weyl or Dirac semimetal with superconductivity have emerged as a new class of topological materials to realize and study Majorana Fermion in its intrinsic form. This article reports the Density Functional Theory (DFT) calculated bulk electronic band structure of recently discovered topological superconductor candidate Sn4Au. This study is further extended to the calculation of Z2 invariants. The Fermi surfaces corresponding to the bands which are responsible for non-trivial band topology along with the surface states are also mapped. The complete study suggests that Sn4Au is a topological semimetal. On Sn4Au, it is the first report in the literature showing the non-trivial band topology based on first-principle calculations.

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Section: Introductionmentioning

confidence: 99%

Non-trivial band topology in the superconductor AuSn₄: a first principle study

Karn

Sharma

Awana

2022

Supercond. Sci. Technol.

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“…The Voigt (V) and Reuss (R) assume that the structure respective has uniform strain and stress distribution. The bulk modulus and shear modulus obtained by the Voigt method and the Reuss method are actually the maximum and minimum values of the polycrystal modulus, respectively [50]. According to bulk modulus B and shear modulus G, the Young's modulus E and the Poisson's ratio ν of isotropic solids are approximately calculated according to E = 9BG/(3B+G) and v = (3B-2G)/(6B+2G).…”

Section: Resultsmentioning

confidence: 99%

First-Principles Study of Structural, Mechanical, and Thermodynamic Properties of Refractory Metals (Rh, Ir, W, Ta, Nb, Mo, Re, and Os)

Sun

Xiong

et al. 2020

MSF

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The structural, mechanical, and thermodynamic properties of refractory metals Rh, Ir, W, Ta, Nb, Mo, Re, and Os have been systematically investigated by first-principles calculations based on density functional theory. Comparative studies reveal that Young's modulus (E = 636.42 GPa), shear modulus (G = 256.81 GPa), bulk modulus (B = 406.55 GPa), and microhardness (H = 44.69 GPa) of hexagonal Os are the highest, which reveals Os has the best overall mechanical properties. The body-centered cubic Nb has the smallest Young's modulus (E = 94.76 GPa), shear modulus (G = 33.62 GPa), bulk modulus (B = 174.50 GPa), and hardness (H = 2.04 GPa). Based on the ratio of bulk to shear modulus, it is judged that Rh, Ir, and Os are brittle materials (B/G < 1.75), and Nb, Ta, Mo, W, and Re exhibit ductile (B/G > 1.75). The elastic anisotropy has also been discussed by plotting both the 3D contours and the 2D planar projections of Young's modulus. For the face-centered cubic metals Rh and Ir and hexagonal close-packed metals Re and Os, the 3D contours of the Young's modulus are very similar, whereas body-centered cubic metals Ta, W, Nb, and Mo exhibit significant difference in elastic anisotropy. The thermodynamic calculations show that Debye temperature and minimum thermal conductivity decreases along Rh, Os, Mo, Ir, Re, W, Ta, Nb sequence. Furthermore, the results can be used as a general guidance for the design and development of high temperature refractory alloy system.

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“…In addition, the addition of Ni and Pd increased the shear modulus and Young's modulus of AuSn 4 IMC, but the Poisson's ratio reduced. 64) The shear strength of Au30Sn, Fig. 17 The shear strength of Au30Sn solder joints is higher than all three of the above.…”

Section: Mechanical Propertiesmentioning

confidence: 88%

Structure and Properties of Au–Sn Lead-Free Solders in Electronic Packaging

Wang

Zhang

2022

Mater. Trans.

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The requirements for electronic devices in high-temperature environment such as avionics and automotive have promoted the development of high-temperature solders. The Au20Sn solder, which is one of the hot topics of the current research in the field of electronic packaging, is widely used in flip-chip, light-emitting diode and hermetic package fields because of its good creep resistance, corrosion resistance and flux-free soldering. Recent research about the microstructure, wettability, interfacial intermetallic compounds, and mechanical properties of Au20Sn solder were reviewed. This paper focuses on the interfacial reaction of Au20Sn with different substrates and the mechanical properties of Au20Sn solder joints. In addition, the current research shortages of Au20Sn solders and the development directions are presented.

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Effect of Ni and Pd Addition on Mechanical, Thermodynamic, and Electronic Properties of AuSn4-Based Intermetallics: A Density Functional Investigation

Cited by 7 publications

References 35 publications

Non-trivial band topology in the superconductor AuSn₄: a first principle study

Non-trivial band topology in the superconductor AuSn₄: a first principle study

First-Principles Study of Structural, Mechanical, and Thermodynamic Properties of Refractory Metals (Rh, Ir, W, Ta, Nb, Mo, Re, and Os)

Structure and Properties of Au–Sn Lead-Free Solders in Electronic Packaging

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Effect of Ni and Pd Addition on Mechanical, Thermodynamic, and Electronic Properties of AuSn4-Based Intermetallics: A Density Functional Investigation

Cited by 7 publications

References 35 publications

Non-trivial band topology in the superconductor AuSn4: a first principle study

Non-trivial band topology in the superconductor AuSn4: a first principle study

First-Principles Study of Structural, Mechanical, and Thermodynamic Properties of Refractory Metals (Rh, Ir, W, Ta, Nb, Mo, Re, and Os)

Structure and Properties of Au–Sn Lead-Free Solders in Electronic Packaging

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Product

Resources

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Non-trivial band topology in the superconductor AuSn₄: a first principle study

Non-trivial band topology in the superconductor AuSn₄: a first principle study