2002
DOI: 10.1016/s0257-8972(01)01569-9
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Effect of nitrogen incorporation in CNx thin films deposited by RF magnetron sputtering

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Cited by 27 publications
(14 citation statements)
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“…One reason could be due to the prolonged exposure of the sample to the laboratory environment. The strong increase of N/C at a low content of N 2 in the gas mixture seems to be mainly due to the incorporation of nitrogen species coming from the plasma on the film surface during deposition [26]. Similar results have been reported for material grown in FCVA system [27] and Electron Cyclotron Wave Resonance [28].…”
Section: Resultssupporting
confidence: 81%
“…One reason could be due to the prolonged exposure of the sample to the laboratory environment. The strong increase of N/C at a low content of N 2 in the gas mixture seems to be mainly due to the incorporation of nitrogen species coming from the plasma on the film surface during deposition [26]. Similar results have been reported for material grown in FCVA system [27] and Electron Cyclotron Wave Resonance [28].…”
Section: Resultssupporting
confidence: 81%
“…1 (a), black circle) increases from 4.3 nm/min, in a pure Ar discharge, to the maximum value of 6.9 nm/min in a discharge with an N 2 /Ar gas ratio of 40%. This variation of the deposition rate vs. the N 2 /Ar gas ratio has already been observed in reactive magnetron sputtering [23,24]. The increase in the deposition rate may be due to the promoted formation of C-N radicals at target surface (i.e.…”
Section: Methodssupporting
confidence: 67%
“…The roughness of the surface usually increases with the discharge pressure. The same phenomenon has been observed in a-CN x films [18]. We also found that absorption below 1.6 eV decreased with an increase in the pressure ratio P 1 while maintaining the total discharge pressure, as shown in Fig.…”
Section: Resultssupporting
confidence: 88%