Effect of pad’s surface deformation and oscillation on monocrystalline silicon wafer surface quality

Choi, Woong-Kirl; Kim, Seong-Hyun; Choi, Seung-Geon; Lee, Eunsang; Lee, Chulhee

doi:10.1007/s12541-014-0594-4

Cited by 4 publications

(2 citation statements)

References 13 publications

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“…As an important semiconductor material, monocrystalline silicon is widely employed in electronics, communications and energy field [1,2,3,4]. With the development of semiconductor material technology, there are increasing demands on the performance and quality of silicon wafers, and the proportion of large-diameter silicon wafers that is suitable for micro fabrication in the market is increasing as well.…”

Section: Introductionmentioning

confidence: 99%

Investigation on the Edge Chipping in Ultrasonic Assisted Sawing of Monocrystalline Silicon

et al. 2019

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Monocrystalline silicon is an important semiconductor material and occupies a large part of the market demand. However, as a hard-brittle material, monocrystalline silicon is extremely prone to happen edge chipping during sawing processing. The edge chipping seriously affects the quality and performance of silicon wafers. In this paper, both conventional and ultrasonicassisted sawing tests were carried out on monocrystalline silicon to study the formation mechanism of edge chipping. The shape and size of edge chipping after sawing process were observed and measured. The experimental results demonstrated that different sawing processes present different material removal modes and edge quality. The mode of crack propagation was continuous cracks in conventional sawing process, while the expansion mode in ultrasonic assisted sawing was blasting microcracks. This results in the cutting force of ultrasonic assisted sawing becomes much smaller than that of conventional sawing process, which can reduce the size of edge chipping and improve the quality of machined surface.

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Section: Introductionmentioning

confidence: 99%

Investigation on the Edge Chipping in Ultrasonic Assisted Sawing of Monocrystalline Silicon

et al. 2019

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“…In addition, a self-assembled monolayer coating and UV ozone treatment were applied. The shape of the nano-micro hybrid structure was determined by SEM images, and the surface characteristics were investigated by contact angle measurements [36,37]. Figure 1a shows a schematic of the nano-imprint process used in this experiment.…”

Section: Introductionmentioning

confidence: 99%

Fabrication of Nano-Micro Hybrid Structures by Replication and Surface Treatment of Nanowires

et al. 2017

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Nanowire structures have attracted attention in various fields, since new characteristics could be acquired in minute regions. Especially, Anodic Aluminum Oxide (AAO) is widely used in the fabrication of nanostructures, which has many nanosized pores and well-organized nano pattern. Using AAO as a template for replication, nanowires with a very high aspect ratio can be fabricated. Herein, we propose a facile method to fabricate a nano-micro hybrid structure using nanowires replicated from AAO, and surface treatment. A polymer resin was coated between Polyethylene terephthalate (PET) and the AAO filter, roller pressed, and UV-cured. After the removal of aluminum by using NaOH solution, the nanowires aggregated to form a micropattern. The resulting structure was subjected to various surface treatments to investigate the surface behavior and wettability. As opposed to reported data, UV-ozone treatment can enhance surface hydrophobicity because the UV energy affects the nanowire surface, thus altering the shape of the aggregated nanowires. The hydrophobicity of the surface could be further improved by octadecyltrichlorosilane (OTS) coating immediately after UV-ozone treatment. We thus demonstrated that the nano-micro hybrid structure could be formed in the middle of nanowire replication, and then, the shape and surface characteristics could be controlled by surface treatment.

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Study on pad cutting rate and surface roughness in diamond dressing process

Pham

Chen

2017

Int. J. Precis. Eng. Manuf.

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Effect of pad’s surface deformation and oscillation on monocrystalline silicon wafer surface quality

Cited by 4 publications

References 13 publications

Investigation on the Edge Chipping in Ultrasonic Assisted Sawing of Monocrystalline Silicon

Investigation on the Edge Chipping in Ultrasonic Assisted Sawing of Monocrystalline Silicon

Fabrication of Nano-Micro Hybrid Structures by Replication and Surface Treatment of Nanowires

Study on pad cutting rate and surface roughness in diamond dressing process

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