This report covers the results of a study on evaluating the effect of nano-SiC particles on mechanical, thermal and electrical properties of epoxy by lap shear, TGA, DSC and electrical tests. Epoxy composites filled with micro-SiC particles were also studied for comparison. The mechanisms of performance improvement were discussed in detail. The results showed that with identical loading, silane treated nano-SiC filled nanocomposites have the best properties. The volume resistivity decrease, dielectric constant " increase and loss tangent tanðÞ increase by addition of silane treated nano-SiC particles are smaller than those by the other fillers. Silane treatment of nanoparticles improves each performance, including increases shear strength, thermal stability, volume resistivity and decreases " and (). The addition of nano-SiC particles remarkably improves shear strength, " and tanðÞ, while slightly enhances thermal stability of epoxy. 8 vol. % silane treated nano-SiC/epoxy composite has the highest shear strength 10.6 MPa with the maximum enhancement, 80%, over the neat resin. It also has good temperature independence of dielectric properties and enough volume resistivity, which meet the demand of some microelectronics materials.KEY WORDS: SiC/Epoxy Composites / Nanocomposites / Mechanical Properties / Thermal Properties / Dielectric Properties / Using inorganic nanofillers to produce high performance nanocomposites is attaining increasing interest. An interface interaction zone of 1 nm thick represents roughly 0.3 vol. % of microcomposites, whereas it can reach 30 vol. % of nanocomposites. 1 The contribution of interaction zone provides diverse possibilities of performance tailoring and is able to influence the performance to a much greater extent under rather low nanofiller loading. Studies have shown that the performance of polymeric materials can be improved by adding a small amount (<5 wt %) of inorganic nanofillers without compromising weight or processability of the composites.2-8 The challenges are to obtain remarkable improvements in the interfacial bonding between polymer matrix and nanofillers. Stronger interfacial bonding will impart better properties.SiC is a large band gap semiconductor (>2 eV) with good mechanical properties, high thermal stability (melting point $2800 C), high thermal conductivity ($390 W/mK), and high electric break down field ($4 Â 10 8 V/m). Such properties make SiC an attractive candidate for high temperature and high power applications in electronic industry.9 Epoxy resins also exhibit versatile applications in electrical and electronic industries, e.g., encapsulant of electrical circuits and electronic devices. Some studies involving the effect of nano-SiC particles on tensile response (stiffness and strength), 4 friction and wear, 5 curing process and curing kinetics 10 of epoxies have been conducted. Recently, developments in semiconductor and electronic packages require electrically insulating materials possessing high strength, good thermal stability, and low dielectric ...