2018
DOI: 10.1016/j.solmat.2018.05.011
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Effect of silicon oxide thickness on polysilicon based passivated contacts for high-efficiency crystalline silicon solar cells

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Cited by 71 publications
(49 citation statements)
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References 27 publications
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“…Although this increase may rise q c , one can find a suitable thickness to balance q c and FLP, which has a key effect on the quantum transport. For practical tunnel oxide passivating contacts, Kale et al 29 have demonstrated that the carrier recombination parameter (J 0 ) decreases with the increasing tunnel oxide or polycrystalline silicon thickness, which is consistent with our simulation results. An optimized tunnel oxide thickness of 1.4-1.6 nm was determined to simultaneously yield low J 0 and q c .…”
supporting
confidence: 92%
“…Although this increase may rise q c , one can find a suitable thickness to balance q c and FLP, which has a key effect on the quantum transport. For practical tunnel oxide passivating contacts, Kale et al 29 have demonstrated that the carrier recombination parameter (J 0 ) decreases with the increasing tunnel oxide or polycrystalline silicon thickness, which is consistent with our simulation results. An optimized tunnel oxide thickness of 1.4-1.6 nm was determined to simultaneously yield low J 0 and q c .…”
supporting
confidence: 92%
“…The doping profile in the poly-Si layer and at the surface of the c-Si substrate is known to play a role in the final surface passivation properties of the poly-Si/SiOx contact [17,32].…”
Section: Variation Of the Doping Profile With Increasing Annealing Temperaturementioning
confidence: 99%
“…The robustness of the poly-Si layer against the subsequent implementation of a metal electrode is also an important requirement to preserve a good surface passivation of the c-Si in the final SC [15]. The passivation efficiency of the features described above (1-3) strongly depends on the fabrication process of the poly-Si/SiOx contact [8,16,17]. This implies convoluted interdependences between these different passivation features, which has, for now, prevented the clear discrimination of their respective contributions to the global surface passivation of the c-Si in the final SC.…”
Section: Introductionmentioning
confidence: 99%
“…• The shallow in-diffusion of dopants from the poly-Si layer to the c-Si substrate, which enhances the field-effect passivation at the c-Si surface [44,45] • The degradation of the interfacial SiOx layer which decreases the chemical passivation properties (interface state density (Dit) increase) [17,46,47] The poly-Si(B)/SiOx samples were first fabricated on mirror polished c-Si wafers. The a-Si:H(B) layer was deposited with optimized deposition conditions (Tdep = 300°C and R = 50).…”
Section: Impact Of Annealing Temperature On Surface Passivation Propementioning
confidence: 99%