Effect of Size of Lid-Substrate Adhesive on Reliability of Solder Balls in Thermally Enhanced Flip Chip PBGA Packages

Determination of Anand parameters for SnAgCuCe solder

“…Most reliability analysis of electronic component soldered joints require the estimation of stress-strain response using the finite element code, which needs the user to provide the constitutive relation of soldered joints for calculation accuracy. The Anand model is a suitable unified viscoplasticity constitutive relation, widely used in the finite element simulation of solder interconnection in electronic components by many researchers [13][14][15][16][17][18][19][20]. In order to apply the Anand model to the simulation of the thermomechanical responses of the SnAgCu soldered joints with the addition of rare earth Ce in electronic packaging, the parameters of the constitutive relations must be previously determined.…”