Effect of slurry injection position on material removal in chemical mechanical planarization

Wang, Tongqing; Zhao, Dewen; He, Yongyong; Lu, Xinchun

doi:10.1007/s00170-012-4702-2

Cited by 13 publications

(2 citation statements)

References 18 publications

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“…In all these processes, sedimentation and agglomeration of loose abrasives are avoided by maintaining the properties of suspension and by precisely feeding the suspension into the polishing zone. [7][8][9] Consistent results are realised by periodically conditioning the polishing pads used in many polishing methods. 10,11 Some of the drawbacks associated with bonded and loose abrasive finishing methods are overcome by unconventional methods of polishing such as liquid-bonded wheel, frozen magnetic fluid grinding wheel, magnetic-bonded abrasive particles, soft abrasive grinding wheel (SAGW), and sol-gel polishing pads.…”

Section: Introductionmentioning

confidence: 97%

Mechanical and tribological properties of ice-bonded abrasive polishing tools

Rambabu

Babu

2017

Proceedings of the Institution of Mechanical Engineers, Part B:

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This article covers the efforts on characterising ice-bonded abrasive polishing tool in terms of the mechanical and tribological properties such as hardness, coefficient of friction, and wear rate. These studies were attempted on the tools prepared at different temperatures ranging from −10 °C to 0 °C with a view to identify the condition suitable to prepare ice-bonded abrasive polishing tool for effective polishing of Ti–6Al–4V alloy specimen. It also presents the methods adopted to determine various properties of ice-bonded abrasive polishing tool. Hardness was estimated from the measured penetration depth of cone shape indenter into the tool, coefficient of friction was determined from the change in power drawn by the motor rotating the tool mould, and wear behaviour of tool was assessed from the melting rate of the tool determined from the change in height of ice-bonded abrasive polishing tool at different stages of polishing. From the results of this study, it is clear that ice-bonded abrasive polishing tool prepared at −4 °C has possessed sufficient hardness, coefficient of friction, and reasonable wear rate suitable for polishing of Ti–6Al–4V specimens. This article also covers the details of low-temperature coolant supply unit developed to prepare the ice-bonded abrasive polishing tool at any desired temperature between 0 °C and −40 °C and thus to maintain it for a long time. Polishing studies with such ice-bonded abrasive polishing tool showed 72% improvement in finish after 90 min of polishing of Ti–6Al–4V specimen with tool, prepared at −4 °C.

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Section: Introductionmentioning

confidence: 97%

Mechanical and tribological properties of ice-bonded abrasive polishing tools

Rambabu

Babu

2017

Proceedings of the Institution of Mechanical Engineers, Part B:

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“…1,2 The same measurements have also been used in end point detection to determine when one layer has been removed and another exposed. 3 Similarly, key advances in our understanding of CMP have come about as a result of the application of pad thermal imaging, 4 measurements of the pressure of the fluid between the wafer and pad, 5,6 capacitance distance measurements of wafer bending and head tilt 7 and confocal microscopy of pad surfaces. 8,9 In this paper, we describe a simple laser tilt measurement system that has been used to monitor the pitch of a novel slurry injection system (SIS).…”

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confidence: 99%

Laser Tilt Measurements of a Slurry Injection System

Borucki¹,

Sampurno

Zhuang

et al. 2015

ECS J. Solid State Sci. Technol.

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In this paper, we describe a method that we have developed for studying the behavior of a novel slurry injection system (SIS) during polishing. The method uses sensitive laser measurements and automated image analysis to infer the pitch of the injector body as a function of time under various conditions on a research polisher. The measurements clearly show the pitch response of the injector during typical CMP processing steps, such as pad rinsing and wafer polishing. Changes in pitch behavior as a function of injector design and operation, in combination with removal rate measurements, suggest explanations for the removal rate behavior of the device. One of the issues in chemical mechanical planarization (CMP) is that it can be difficult to gather fundamental data that can be used to understand what is happening during the process. Many of the advances in understanding and subsequent improvements in CMP have come about through innovative metrology. For example, measurements of the friction force between the pad and wafer have provided fundamental information about the lubrication regime of the process.1,2 The same measurements have also been used in end point detection to determine when one layer has been removed and another exposed. Similarly, key advances in our understanding of CMP have come about as a result of the application of pad thermal imaging, 4 measurements of the pressure of the fluid between the wafer and pad, 5,6 capacitance distance measurements of wafer bending and head tilt 7 and confocal microscopy of pad surfaces. 8,9 In this paper, we describe a simple laser tilt measurement system that has been used to monitor the pitch of a novel slurry injection system (SIS). The laser measurements provide some insight into the behavior of the injection system during typical processing procedures, such as pad rinsing and wafer polishing. These insights help explain the important factors underlying the performance of the injector. As a side effect, the measurements also uncover an unsuspected behavior of the polisher. The Slurry Injection System (SIS)The SIS used in this study, and its performance have been described in detail elsewhere. [10][11][12][13][14] The particular model of the SIS employed here was developed for the AMAT Mirra polisher (Fig. 1). The functional part of the system is the injector body, which is rectangular and has a bottom made of PEEK (polyetheretherketone). The bottom is patterned and flexible and is meant to be held in close contact with the pad using a light load. The system is connected to the polisher through gimbal points that sit well in front of the device and close to the pad surface; these points therefore can apply only small pitching torques to the body. Slurry is applied through one or more tubes that protrude through the cover of the device. The slurry feeds into a narrow open channel in the bottom and is distributed in the radial direction of the polishing pad. Slurry is then advected from the channel by the moving pad surface and emerges from the trailing edge of th...

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A stack fusion model for material removal rate prediction in chemical-mechanical planarization process

Zhao

Huang

2018

Int J Adv Manuf Technol

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Effect of slurry injection position on material removal in chemical mechanical planarization

Cited by 13 publications

References 18 publications

Mechanical and tribological properties of ice-bonded abrasive polishing tools

Mechanical and tribological properties of ice-bonded abrasive polishing tools

Laser Tilt Measurements of a Slurry Injection System

A stack fusion model for material removal rate prediction in chemical-mechanical planarization process

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