Effect of solder resist dissolution on the joint reliability of ENIG surface and Sn–Ag–Cu solder

Lee, Hyunju; Kim, Cheol-Min; Heo, Cheolho; Kim, Chiho; Lee, Jae-Ho; Kim, Jae Won

doi:10.1016/j.microrel.2018.05.017

Cited by 26 publications

(6 citation statements)

References 14 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Although a great deal of research based on this experimental method has been conducted in the field of BGA solders, these research works mainly focus on solder ball materials and manufacturing processes. Their major task has been to distinguish the shear stress characteristics of tested solder balls under various different conditions, including alloy element proportions [ 2 , 12 , 13 , 14 , 15 ], manufacturing processes [ 16 , 17 ], solder ball dimensions [ 18 , 19 ], aging time [ 18 , 20 ], surface finish materials [ 1 , 21 , 22 ], and more. These research efforts have provided effective support in the procedures of material proportioning and manufacturing process design for highly reliable and stable lead-free solders.…”

Section: Introductionmentioning

confidence: 99%

Experimental and Statistical Study of the Fracture Mechanism of Sn96.5Ag3Cu0.5 Solder Joints via Ball Shear Test

Kun

Wang

2022

Materials

View full text Add to dashboard Cite

Ball shear testing is an efficient approach to investigate the mechanical reliability of solder joints at the structural level. In the present study, a series of low-speed ball shear tests were conducted to study the deformation and fracture characteristics of Sn96.5Ag3Cu0.5 solder joints at continuous speeds from 10 μm/s to 200 μm/s. In order to account for randomness, the quantity of tests was repeated for each shear rate. The relationship between mechanical properties and shear speeds was calculated in detail via effective statistical analysis. In addition, by utilizing SEM imaging and ingredient analysis the interfacial effect and fracture mechanism of solder balls were obtained and their fracture mode classified into two types, viz., bulk fracture and interface fracture. Furthermore, by means of statistical analysis and approximate calculation it was proven that bulk fracture balls have greater adhesive powers and reliability compared with interface fracture balls.

show abstract

Section: Introductionmentioning

confidence: 99%

Experimental and Statistical Study of the Fracture Mechanism of Sn96.5Ag3Cu0.5 Solder Joints via Ball Shear Test

Kun

Wang

2022

Materials

View full text Add to dashboard Cite

show abstract

“…The current issue and full text archive of this journal is available on Emerald Insight at: https://www.emerald.com/insight/0954-0911.htm joints (Lee et al, 2018). A study has shown that when the distance between bumps is less than 140 m m, micro bumps are prone to cause a series of reliability problems, such as electromigration failure (Zuo et al, 2018).…”

Section: Introductionmentioning

confidence: 99%

“…In the lead-free process, one of the most prominent problems caused by material change is the reliability of lead-free solder joints (Lee et al , 2018). A study has shown that when the distance between bumps is less than 140 μ m, micro bumps are prone to cause a series of reliability problems, such as electromigration failure (Zuo et al , 2018).…”

Section: Introductionmentioning

confidence: 99%

A study on the effects of electrical and thermal stresses on void formation and migration lifetime of Sn3.0Ag0.5Cu solder joints

Wan

et al. 2021

SSMT

View full text Add to dashboard Cite

Purpose The purpose of this study is to investigate the effect of electrical and thermal stresses on the void formation of the Sn3.0Ag0.5Cu (SAC305) lead-free ball grid array (BGA) solder joints and to propose a modified mean-time-to-failure (MTTF) equation when joints are subjected to coupling stress. Design/methodology/approach The samples of the BGA package were subjected to a migration test at different currents and temperatures. Voltage variation was recorded for analysis. Scanning electron microscope and electron back-scattered diffraction were applied to achieve the micromorphological observations. Additionally, the experimental and simulation results were combined to fit the modified model parameters. Findings Voids appeared at the corner of the cathode. The resistance of the daisy chain increased. Two stages of resistance variation were confirmed. The crystal lattice orientation rotated and became consistent and ordered. Electrical and thermal stresses had an impact on the void formation. As the current density and temperature increased, the void increased. The lifetime of the solder joint decreased as the electrical and thermal stresses increased. A modified MTTF model was proposed and its parameters were confirmed by theoretical derivation and test data fitting. Originality/value This study focuses on the effects of coupling stress on the void formation of the SAC305 BGA solder joint. The microstructure and macroscopic performance were studied to identify the effects of different stresses with the use of a variety of analytical methods. The modified MTTF model was constructed for application to SAC305 BGA solder joints. It was found suitable for larger current densities and larger influences of Joule heating and for the welding ball structure with current crowding.

show abstract

“…The atomic diffusion across the interface was suppressed and the growth rate of the IMC was slower because of the addition of the graphene coating. In addition, as Sn-Ag-Cu solder presents better ductility than SnBi (Lee et al, 2018), it can be used as an interfacial layer between SnBi and a substrate material. Liu et al (2019aLiu et al ( , 2019bLiu et al ( , 2019c designed a solder superposition structure that added an appropriate size of Sn-3.0Ag-0.5Cu (SAC305) solder balls between the SnBi solder and the Cu substrate.…”

Section: Introductionmentioning

confidence: 99%

Effects of Sn-Ag-x leveling layers on the microstructure and mechanical properties of SnBi low-temperature solder joints

Liu

Xue

Zhou

et al. 2021

SSMT

View full text Add to dashboard Cite

Purpose The purpose of this paper is to investigate the effects of Sn-Ag-x leveling layers on the mechanical properties of SnBi solder joints. Four Sn-Ag-x (Sn-3.0Ag-0.5Cu, Sn-0.3Ag-0.7Cu, Sn-0.3Ag-0.7Cu-0.5 Bi-0.05Ni and Sn-3.0Ag-3.0 Bi-3.0In) leveling layers were coated on Cu pads to prepare SnBi/Sn-Ag-x/Cu solder joints. The microstructure, hardness, shear strength and fracture morphology of solder joints before and after aging were studied. Design/methodology/approach The interfacial brittleness of the SnBi low-temperature solder joint is a key problem affecting its reliability. The purpose of this study is to improve the mechanical properties of the SnBi solder joint. Findings Owing to the addition of the leveling layers, the grain size of the ß-Sn phase in the SnBi/Sn-Ag-x/Cu solder joint is significantly larger than that in the SnBi/Cu eutectic solder joint. Meanwhile, the hardness of the solder bulk in the SnBi/Cu solder joint shows a decrease trend because of the addition of the leveling layers. The SnBi/Cu solder joint shows obvious strength drop and interfacial brittle fracture after aging. Through the addition of the Sn-Ag-x layers, the brittle failure caused by aging is effectively suppressed. In addition, the Sn-Ag-x leveling layers improve the shear strength of the SnBi/Cu solder joint after aging. Among them, the SnBi/SACBN/Cu solder joint shows the highest shear strength. Originality/value This work suppresses the interfacial brittleness of the SnBi/Cu solder joint after isothermal aging by adding Sn-Ag-x leveling layers on the Cu pads. It provides a way to improve the mechanical performances of the SnBi solder joint.

show abstract

Effect of solder resist dissolution on the joint reliability of ENIG surface and Sn–Ag–Cu solder

Cited by 26 publications

References 14 publications

Experimental and Statistical Study of the Fracture Mechanism of Sn96.5Ag3Cu0.5 Solder Joints via Ball Shear Test

Experimental and Statistical Study of the Fracture Mechanism of Sn96.5Ag3Cu0.5 Solder Joints via Ball Shear Test

A study on the effects of electrical and thermal stresses on void formation and migration lifetime of Sn3.0Ag0.5Cu solder joints

Effects of Sn-Ag-x leveling layers on the microstructure and mechanical properties of SnBi low-temperature solder joints

Contact Info

Product

Resources

About