2006
DOI: 10.1016/j.apsusc.2006.05.040
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Effect of substrate temperature and annealing temperature on the structural, electrical and microstructural properties of thin Pt films by rf magnetron sputtering

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Cited by 33 publications
(25 citation statements)
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“…A regular shift of the Pt (111) peak towards higher angles (from 39.60° to 39.93°) is observed when the substrate temperature was increased from room temperature to 625 °C. A similar trend has been reported for 40 nm thick Pt thin films [27] and for 150 nm and 360 nm Pt thin films grown by DC sputtering on silicon substrate [15]. These films were deposited at room temperature and then annealed in argon at temperatures varying from 400 to 850 °C, and a shift of the (111) X-ray peak from 39.76° to 39.91° was obtained.…”
Section: Influence Of Deposition Temperature On Pt Crystallization Ansupporting
confidence: 79%
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“…A regular shift of the Pt (111) peak towards higher angles (from 39.60° to 39.93°) is observed when the substrate temperature was increased from room temperature to 625 °C. A similar trend has been reported for 40 nm thick Pt thin films [27] and for 150 nm and 360 nm Pt thin films grown by DC sputtering on silicon substrate [15]. These films were deposited at room temperature and then annealed in argon at temperatures varying from 400 to 850 °C, and a shift of the (111) X-ray peak from 39.76° to 39.91° was obtained.…”
Section: Influence Of Deposition Temperature On Pt Crystallization Ansupporting
confidence: 79%
“…The slight increase in resistivity at low deposition temperature can be related to the smaller grain size and therefore to the presence of more grain boundaries in the thin films. The decrease in the resistivity of Pt film as the deposition temperature increases had already been observed [3,27,28]. Depending on the growth conditions, Sakaliuniene et al obtained resistivities of the order of 25 to 85 µΩ cm for Pt thin films deposited at low temperature on TiO 2 /Si, and of 25 to 65 µΩ cm after annealing [3].…”
Section: Influence Of Deposition Temperature On Pt Resistivitymentioning
confidence: 82%
“…The resistivity of both films decreased with increasing annealing temperature. This is related with the annihilation of the point defects and grain boundary [13]. The grain size of both films increased after annealing at high temperature, resulting in less grain boundary inside the films.…”
Section: Microstructure and Resistivity Of Pt-rh Filmsmentioning
confidence: 94%
“…This was supported by the following SEM-EDX measurement. 1 The signal of C element comes from the epoxy resin used for sample fixation. For the sp-Pt catalyst (Fig.…”
Section: Carbon Oxidation Reactionmentioning
confidence: 99%
“…The sputter deposition method was widely used to fabricate thin film such as Pt [1], Au [2], and Ni [3] films on substrate. Recently, sputter deposition method was explored as an approach to the preparation of heterogeneous catalysts.…”
Section: Introductionmentioning
confidence: 99%