Effect of the deposition parameters on the voiding propensity of solder joints with Cu electroplated in a Hull cell

Wafula, Fred; Liu, Y.; Yin, Liang; Børgesen, Peter; Cotts, E. J.; Dimitrov, Nikolay

doi:10.1007/s10800-011-0257-4

Cited by 26 publications

(21 citation statements)

References 18 publications

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“…Dimitrov's group [16,17,[33][34][35] also studied the impurity effect since 2008 by using various additive combinations including PEG, SPS, and Cl − . The individual use of PEG or Cl − resulted in a lower overpotential in the electrodeposition of Cu, but the use of PEG + Cl − (nominated as PC) caused an increment in the overpotential, showing that PEG is a suppressor and needs to co-work with the Cl − ions.…”

Section: Effects Of Impurity On Interfacial Reactions Of Electroplatementioning

confidence: 99%

Impurity Effects in Electroplated-Copper Solder Joints

Lee

Chen

2018

Metals

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Copper (Cu) electroplating is a mature technology, and has been extensively applied in microelectronic industry. With the development of advanced microelectronic packaging, Cu electroplating encounters new challenges for atomic deposition on a non-planar substrate and to deliver good throwing power and uniform deposit properties in a high-aspect-ratio trench. The use of organic additives plays an important role in modulating the atomic deposition to achieve successful metallic coverage and filling, which strongly relies on the adsorptive and chemical interactions among additives on the surface of growing film. However, the adsorptive characteristic of organic additives inevitably results in an incorporation of additive-derived impurities in the electroplated Cu film. The incorporation of high-level impurities originating from the use of polyethylene glycol (PEG) and chlorine ions significantly affects the microstructural evolution of the electroplated Cu film, and the electroplated-Cu solder joints, leading to the formation of undesired voids at the joint interface. However, the addition of bis(3-sulfopropyl) disulfide (SPS) with a critical concentration suppresses the impurity incorporation and the void formation. In this article, relevant studies were reviewed, and the focus was placed on the effects of additive formula and plating parameters on the impurity incorporation in the electroplated Cu film, and the void formation in the solder joints.

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Section: Effects Of Impurity On Interfacial Reactions Of Electroplatementioning

confidence: 99%

Impurity Effects in Electroplated-Copper Solder Joints

Lee

Chen

2018

Metals

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“…[18][19][20][21] The present work provides an overview of previous studies in our group with reference to the proposed picture. Additional results from XRD of various electroplated Cu samples are also presented to support the general picture.…”

Section: A General Picturementioning

confidence: 99%

“…The instability of PEG was confirmed in a separate study. 21 The texture coefficient plots in Fig. 8 show the results of surface texture evolution of samples plated from the SPS + PEG + Cl À system.…”

Section: Effect Of Bath Agementioning

confidence: 99%

“…10 Laboratory-scale electroplating studies with generic organic additives showed that the voiding level correlated closely with the amount of impurities in the Cu deposits, measured by secondary-ion mass spectroscopy (SIMS) or glow discharge mass spectroscopy (GDMS). [18][19][20][21][22] Those studies also showed that impurity incorporation was affected by a range of electroplating process parameters: additive combination, current density, plating bath temperature, and bath age. Yu and Kim reported the observation of residue S (sulfur) on the Cu/Cu 3 Sn interface by Auger electron spectroscopy (AES) and attributed it to an organic additive used in their Cu electroplating bath.…”

Section: Introductionmentioning

confidence: 99%

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Toward a Better Understanding of the Effect of Cu Electroplating Process Parameters on Cu3Sn Voiding

Yin

Wafula

Dimitrov

et al. 2011

Journal of Elec Materi

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Kirkendall voiding'' in the interfacial Cu 3 Sn intermetallic compound is often observed in solder joints made between Sn-containing alloys and Cu interconnect pads, during extended thermal aging or electromigration testing. It is commonly believed that voids arise from the Kirkendall effect, i.e., the imbalance of diffusion fluxes of Cu and Sn atoms in Cu 3 Sn. However, recent studies have demonstrated that the propensity for voiding is greatly affected by the amount of organic impurities incorporated during Cu electroplating. The level of impurities was shown to depend on various electroplating parameters, such as current density, bath temperature, bath age, etc. In this study, a general picture is proposed to provide a better understanding of the effect of electroplating process parameters on Cu 3 Sn voiding. The picture correlates the level of impurity incorporation to (1) the applied electroplating overpotential, and (2) the crystallographic orientation of the Cu deposit. As a first-order approximation, the picture is supported by a variety of electroplating experiments, secondary-ion mass spectroscopy (SIMS), and x-ray diffraction (XRD) analysis.

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“…Under these circumstances, the drawback is the inclusion of thiourea molecules or fragments in the cathodic deposit. Other addition agents containing sulfur as heteroatom are bis(3-sulfopropyl) disulfide [5,6] and 3-mercapto-1-propanesulfonate [7,8]. The adsorption of inhibition agents can also occur if the heteroatom is another electronegative atom such as oxygen or nitrogen.…”

Section: Introductionmentioning

confidence: 99%

Inhibition effect of some aromatic amines on copper electrodeposition from acidic baths

et al. 2012

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To improve the quality requirements for copper deposits, the influence of some inhibition agents added to the acidic copper bath has been studied. Several aromatic nitrogen compounds have been tested as inhibition agents, such as aniline, N-methylaniline, N-ethylaniline, N,Ndimethylaniline (DMA), and N,N-diethylaniline (DEA). The electrochemical behavior of these organic additives and the most relevant aspects of the electrochemical behavior of copper in acid solutions have been analyzed by cyclic voltammetry. At the same time, a correlation between voltammetric data and molecular properties of protonated amines obtained by molecular modeling has been performed. The morphology of the copper deposits obtained in the absence and presence of organic compounds has been studied by scanning electron microscopy. An improvement of the roughness degree and crystallite size upon addition of aromatic amine has been found. Best results were obtained for DMA and DEA working at room temperature (25 ± 0.1°C) and 200 A m -2 current density, in 1 mol L -1 sulfuric acid solution with 50 g L -1 Cu 2? .

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Effect of the deposition parameters on the voiding propensity of solder joints with Cu electroplated in a Hull cell

Cited by 26 publications

References 18 publications

Impurity Effects in Electroplated-Copper Solder Joints

Impurity Effects in Electroplated-Copper Solder Joints

Toward a Better Understanding of the Effect of Cu Electroplating Process Parameters on Cu3Sn Voiding

Inhibition effect of some aromatic amines on copper electrodeposition from acidic baths

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