2018
DOI: 10.1134/s0020168518050151
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Effect of the Surface Modification of Synthetic Diamond with Nickel or Tungsten on the Properties of Copper–Diamond Composites

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Cited by 18 publications
(7 citation statements)
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“…The low thermal expansion coefficients of the composites further confirm a strong diamond-Cu connection. It can be seen from Figure 6F that compared with the diamond/Cu composite reported in the literature, 6,8,10,13,15,16,[18][19][20]32,33 the experimental thermal diffusivity of 311 mm 2 s −1 is the highest, and the density of 3.78 g cm −3 is the lowest, which are more in line with the requirements of high thermal diffusion and lightweight electronic packaging materials.…”
supporting
confidence: 76%
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“…The low thermal expansion coefficients of the composites further confirm a strong diamond-Cu connection. It can be seen from Figure 6F that compared with the diamond/Cu composite reported in the literature, 6,8,10,13,15,16,[18][19][20]32,33 the experimental thermal diffusivity of 311 mm 2 s −1 is the highest, and the density of 3.78 g cm −3 is the lowest, which are more in line with the requirements of high thermal diffusion and lightweight electronic packaging materials.…”
supporting
confidence: 76%
“…12 Commonly used transition layer metals include Chromium (Cr), [12][13][14] Titanium (Ti), 5 Zirconium (Zr), 8,15 Boron (B), [16][17][18] and Tungsten (W). 10,19,20 For instance, adding 1.5 wt% Ti to Cu metal was reported to improve the interface bonding between the copper matrix and diamond, in which the thermal conductivity of the Cu-diamond (55 vol%) composite prepared by hot forging can reach up to 410 W m −1 K −1 . 5 In another study, it was reported that Cu-3 wt% Cr/diamond (55 vol%) composite materials have a thermal conductivity of 433 W m −1 K −1 .…”
Section: Introductionmentioning
confidence: 99%
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“…This problem can be solved by depositing coatings on the diamond surface. Several methods have been used to modify the diamond surface [ 2 , 3 , 4 , 5 , 6 ], which include magnetron sputtering and electroless plating [ 2 ], magnetron sputtering combined with annealing [ 3 ], and the vacuum micro-vapor deposition method [ 4 ]. The carbide-forming metals are mainly used for making the coatings [ 7 , 8 , 9 ].…”
Section: Introductionmentioning
confidence: 99%
“…Therefore, pretreatment of the diamond powders is very important for ensuring adhesion between the diamond and matrix. In recent years, research has focused on surface pretreatments of the diamond to solve such problems [16][17][18]. Scholars found that tungsten layers can be coated on diamond by a microvacuum evaporation diffusion method and then, diamond/copper composites can be prepared by vacuum pressureless infiltration.…”
Section: Introductionmentioning
confidence: 99%