Effect of voids on thermomechanical cracking in lead-free Sn3Ag0.5Cu interconnections of power modules

Hagberg, J.; Nousiainen, Olli; Putaala, Jussi; Salmela, Olli; Raumanni, Juha; Rahko, Matti; Kangasvieri, T.; Jääskeläinen, Jussi; Galkin, Timo; Jantunen, Heli

doi:10.1016/j.microrel.2020.113674

Cited by 8 publications

(6 citation statements)

References 37 publications

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“…Huang et al (2020) studied the fatigue of die-attach solder joints in insulated gate bipolar transistor and revealed that the main failure mode of Sn-Ag-Cu (SAC) solder alloy under power cycling is cracking, while the failure mode under transient electrical/thermal shock is interface detachment. Hagberg et al (2020) studied the effect of voids in SAC305 solder joints on thermomechanical failure. During the temperature cycling test, thermomechanical stress caused localized recrystallization of SAC matrix near voids.…”

Section: Introductionmentioning

confidence: 99%

“…During the temperature cycling test, thermomechanical stress caused localized recrystallization of SAC matrix near voids. Finally, these recrystallization zones form creep-related intergranular cracks and destroy the reliability of solder joints interconnection (Hagberg et al , 2020). However, in many studies, the effects of the location of interface cracks and the direction of crack propagation on solder life have been neglected.…”

Section: Introductionmentioning

confidence: 99%

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Effects of interface cracks on reliability of surface mount technology interconnection in service environment

Liu

Yao

Xue

et al. 2023

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Purpose Surface mount technology (SMT) is widely used and plays an important role in electronic equipment. The purpose of this paper is to reveal the effects of interface cracks on the fatigue life of SMT solder joint under service load and to provide some valuable reference information for improving service reliability of SMT packages. Design/methodology/approach A 3D geometric model of SMT package is established. The mechanical properties of SMT solder joint under thermal cycling load and random vibration load were solved by 3D finite element analysis. The fatigue life of SMT solder joint under different loads can be calculated by using the modified Coffin–Manson model and high-cycle fatigue model. Findings The results revealed that cracks at different locations and propagation directions have different effect on the fatigue life of the SMT solder joint. From the location of the cracks, Crack 1 has the most significant impact on the thermal fatigue life of the solder joint. Under the same thermal cycling conditions, its life has decreased by 46.98%, followed by Crack 2, Crack 4 and Crack 3. On the other hand, under the same random vibration load, Crack 4 has the most significant impact on the solder joint fatigue life, reducing its life by 81.39%, followed by Crack 1, Crack 3 and Crack 2. From the crack propagation direction, with the increase of crack depth, the thermal fatigue life of the SMT solder joint decreases sharply at first and then continues to decline almost linearly. The random vibration fatigue life of the solder joint decreases continuously with the increase of crack depth. From the crack depth of 0.01 mm to 0.05 mm, the random vibration fatigue life decreases by 86.75%. When the crack width increases, the thermal and random vibration fatigue life of the solder joint decreases almost linearly. Originality/value This paper investigates the effects of interface cracks on the fatigue life and provides useful information on the reliability of SMT packages.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Effects of interface cracks on reliability of surface mount technology interconnection in service environment

Liu

Yao

Xue

et al. 2023

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“…It has been found that macro voids will lead to increased resistance and decreased conductivity of the solder ball [ 7 ]. Moreover, the thermal stress of a solder ball with macro voids will increase when it is subjected to a temperature cycling load, thereby reducing the thermal-mechanical reliability of the solder ball [ 8 ].…”

Section: Introductionmentioning

confidence: 99%

Effects of Voids on Thermal Fatigue Reliability of Solder Joints on Inner Rings in Ball Grid Array Packaging by Finite Element Analysis

Liu

et al. 2023

Micromachines

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Under alternating temperatures, the fatigue failure of solder balls caused by the mismatch of the thermal expansion coefficient is a key problem in a Ball Grid Array (BGA). However, the combined effects of the solder ball location and the size of voids within it can seriously affect the thermal fatigue reliability of BGA solder balls, which can be easily ignored by researchers. Firstly, the thermal fatigue reliability of the board-level solder balls was evaluated by a temperature cycling test of the BGA package at −20 °C–+125 °C. The experimental results showed that the thermal fatigue reliability of the outer ring’s solder joint was lower than that of the inner ring. Secondly, the reliability of the solder balls in the BGA package was studied under the same thermal cycling condition based on finite element analysis (FEA). The influences of voids on fatigue life were investigated. Generally, a linear correlation between the void content and the fatigue life of the inner rings’ solder balls could be identified with a gradually smoothed relationship for solder balls closer to the center. In addition, when the size of the void exceeded a critical volume, the inner ring’s solder ball with the void would fail before the outermost ring. The results of FEA showed that the critical void volume ratio from the second to fifth ring increased from 10.5% to 42.3%. This study provides a valuable reference for the influence of voids on the thermal fatigue reliability of BGA solder balls.

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“…Currently, common die-bonding materials are Sn-Ag-Cu solder (SAC305) and Au80Sn20 eutectic solder (AuSn), which realize reliable chip fixation under various bonding temperatures and pressures [12][13][14]. Although the SAC305 has the advantages of good solderability, low melting point, and low cost, it struggles to withstand high operation temperature and the die-bonding layer has poor electrical conductivity and large brittleness [15,16]. The AuSn enhances the tolerable temperature and bonding strength of die-bonding layer, but it requires high-cost equipment and the high process temperature easy to damage chips [17].…”

Section: Introductionmentioning

confidence: 99%

Effects of Bonding Materials on Optical–Thermal Performances and High-Temperature Reliability of High-Power LED

et al. 2022

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The die-bonding layer between chips and substrate determinates the heat conduction efficiency of high-power LED. Sn-based solder, AuSn20 eutectic, and nano-Ag paste were widely applied to LED interconnection. In this paper, the optical–thermal performances and high-temperature reliability of LED with these bonding materials have systematically compared and studied. The thermal conductivity, electrical resistivity, and mechanical property of these bonding materials were characterized. The LED module packaged with nano-Ag has a minimum working temperature of 21.5 °C. The total thermal resistance of LED packaged with nano-Ag, Au80Sn20, and SAC305 is 4.82, 7.84, and 8.75 K/W, respectively, which is 4.72, 6.14, and 7.84 K/W higher after aging for 500 h. Meanwhile, the junction temperature change of these LEDs increases from 2.33, 3.76, and 4.25 °C to 4.34, 4.81, and 6.41 °C after aging, respectively. The thermal resistance of the nano-Ag, Au80Sn20 and SAC305 layer after aging is 1.5%, 65.7%, and 151.5% higher than before aging, respectively. After aging, the LED bonded with nano-Ag has the better optical performances in spectral intensity and light output power, which indicates its excellent heat dissipation can improve the light efficiency. These results demonstrate the nano-Ag bonding material could enhance the optical-thermal performances and high-temperature reliability of high-power LED.

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Effect of voids on thermomechanical cracking in lead-free Sn3Ag0.5Cu interconnections of power modules

Cited by 8 publications

References 37 publications

Effects of interface cracks on reliability of surface mount technology interconnection in service environment

Effects of interface cracks on reliability of surface mount technology interconnection in service environment

Effects of Voids on Thermal Fatigue Reliability of Solder Joints on Inner Rings in Ball Grid Array Packaging by Finite Element Analysis

Effects of Bonding Materials on Optical–Thermal Performances and High-Temperature Reliability of High-Power LED

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