2010
DOI: 10.1007/s00339-010-5623-2
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Effective hydrogenation and surface damage induced by MW-ECR plasma of fine-grained polycrystalline silicon

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Cited by 6 publications
(3 citation statements)
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“…On the other hand, preferential diffusion along grain boundaries upon laser processing at high scan speed cannot be ruled out, as it cannot be measured by SIMS. Figure 7 plots also the Suns-V oc curve of the laser and hydrogenated sample and it is shown that the curve is strongly shifted towards higher V oc values indicating an effective defect passivation by hydrogen atoms generated by plasma [15]. This improvement is witnessed by the very low values of the saturation current densities and the ideality factor close to 1 as reported in Table 1.…”
Section: Electronic Qualitymentioning
confidence: 63%
“…On the other hand, preferential diffusion along grain boundaries upon laser processing at high scan speed cannot be ruled out, as it cannot be measured by SIMS. Figure 7 plots also the Suns-V oc curve of the laser and hydrogenated sample and it is shown that the curve is strongly shifted towards higher V oc values indicating an effective defect passivation by hydrogen atoms generated by plasma [15]. This improvement is witnessed by the very low values of the saturation current densities and the ideality factor close to 1 as reported in Table 1.…”
Section: Electronic Qualitymentioning
confidence: 63%
“…This situation is probably related to the accumulation of molecular hydrogen beneath the n + surface, which strongly hinders the hydrogen diffusion in the bulk [17,35]. As reported in other works [38,39], the improvement in open circuit voltage after hydrogenation is mainly due to the neutralization or passivation of defects at grain boundaries and inside the grains (dislocations) of polycrystalline silicon films. This is accomplished by the fact that high doses of atomic hydrogen diffuse across the surface of the n + emitter into the silicon volume from the plasma environment.…”
Section: Defects Passivation Behaviormentioning
confidence: 89%
“…13 Depositing SiN x :H onto the surface of polysilicon is the most widely used passivation way in virtually all solar cells (laboratory and industrial). In order to make H diffusing into the materials, a thermal annealing should be performed.…”
mentioning
confidence: 99%