Effects of abrasive particle size and tool surface irregularities on wear rates of work and tool in polishing processes

Hung, Tu-Chieh; Chang, Shao-Heng; Lin, Cheng-Chi; Su, Yi-Sheng

doi:10.1016/j.mee.2011.04.055

Cited by 7 publications

(2 citation statements)

References 20 publications

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“…The effects of the particle size on MRR had been studied in the past, and numerous theories had been proposed [4,13,14]. Figure 2 showed that with increased particle size, the polishing rate increased substantially (series 1).…”

Section: Resultsmentioning

confidence: 99%

Factor Effect on Material Removal Rate During Phosphate Laser Glass Polishing

Chen

Yao

Yang

et al. 2014

Materials and Manufacturing Processes

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In this work, the effects of different process parameters on the material removal rate (MRR) of phosphate laser glass during ring polishing had been investigated. Experiments were performed on a ring polishing machine that had a pad diameter of 4.4 m, and the MRR was obtained by the measurements of depth reduction of a groove on phosphate glass sample. The experimental results and analyses showed that size of the abrasive particles and the ceria concentration had significant effects on the polishing rate. The MRR of glass being polished on the annular-grooved pad was almost three times as when polished on the square-grooved pad. When the pad was periodically cleaned with water and glass was polished with fresh slurry, the value of MRR tended to be constant. Based on the experimental results, a combined process was designed to optimize MRR. The results of this study provided the essential foundation for obtaining the required MRR and optimizing the fabrication technique.

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Section: Resultsmentioning

confidence: 99%

Factor Effect on Material Removal Rate During Phosphate Laser Glass Polishing

Chen

Yao

Yang

et al. 2014

Materials and Manufacturing Processes

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“…Regardless of chemical erosion or reaction, the mechanical wear is influenced by many variables in a typical polishing process, such as process parameters including pressure, indentation depth and velocity and other important parameters including the wafer nature, abrasive size, and abrasive geometry, etc. [1,3,[8][9][10][11]. In addition, the slurry is another factor which has a significant effect on the polishing environment and makes the polishing process more complicated [12][13][14].…”

Section: Introductionmentioning

confidence: 99%

Surface Removal of Copper Thin Film under the Ultrathin Water Environment for Nanoscale Process

Shi¹,

Peng²,

Chen³

et al. 2018

Preprint

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The surface planarity and asperity removal behaviors of atomic scale under the ultrathin water environment was studied for the nanoscale process by molecular dynamics simulation. The monolayer atomic removal was achieved under the noncontact and monoatomic layer contact conditions with different water film thickness, and the newly formed surface is relatively smooth and no deformed layer and plastic defects exist. The nanoscale processing is governed by the interatomic adhering action during which the water film transmits the loading forces to Cu surface and thereby result in the migration and removal of surface atoms. With scratching depth ≥ 0.5 nm, the abrasive particle squeezed out the water film from scratching region and scratched Cu surface directly, leading to the surface quality deterioration mainly governed by the plowing action. This study brings the goals of “0 nm planarity, 0 residual defects and 0 polishing pressure” closer to us in the nanoscale process for the development of ultra-precision manufacture technology.

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Flexible CNC polishing process and surface integrity of blades

Lin

Shan

et al. 2018

J Mech Sci Technol

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Effects of abrasive particle size and tool surface irregularities on wear rates of work and tool in polishing processes

Cited by 7 publications

References 20 publications

Factor Effect on Material Removal Rate During Phosphate Laser Glass Polishing

Factor Effect on Material Removal Rate During Phosphate Laser Glass Polishing

Surface Removal of Copper Thin Film under the Ultrathin Water Environment for Nanoscale Process

Flexible CNC polishing process and surface integrity of blades

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