Articles you may be interested inPhysical and electrical properties of low temperature ( C ) SiO 2 films deposited by electron cyclotron resonance plasmas J. Vac. Sci. Technol. A 21, 728 (2003); 10.1116/1.1562179 Optical, electrical, and structural characteristics of yttrium oxide films deposited on plasma etched silicon substrates J.Electrical properties of silicon nitride films prepared by electron cyclotron resonance assisted sputter deposition To develop methods for the formation of metal-insulator-semiconductor ͑MIS͒ devices at low temperature, thin SiO 2 , SiO X N Y , and SiN X films were reactively sputtered onto nonheated silicon substrates using different sputtering and ion assist parameters. SiO 2 was prepared by bombarding Si with Ar ϩ ions in Ar/O 2 ambient whereas SiO X N Y and SiN X films were prepared by bombarding Si 3 N 4 with N 2 ϩ ions in N 2 /O 2 and Ar/N 2 ambients, respectively. In addition, 300 eV N 2 ϩ ion assistance was used during preparation of SiN X films to enhance film nitriding. The 100-300 eV Ar ϩ ion assistance was also used during preparation of SiO 2 to investigate the electrical damage effects caused by energetic ion bombardment during sputtering of the insulator film. The bulk and interfacial electrical properties of these films, which were assessed from current-voltage and high-frequency capacitance-voltage (C -V) measurements on MIS structures, indicate that the Si native oxide and type of anneal play a key role in determining the final film-interface quality. SiO X N Y sputtered films exhibit poorer C -V electrical characteristics with increasing nitrogen content resulting from the creation of positive fixed charge in the film and fast interfacial states. This damage can be suppressed using a native oxide but this increases the instability of the interface. Ion assistance of SiO 2 films increased the level of electrical damage to the film in the bulk and in the vicinity of the interface. The majority of this damage manifests itself as fixed charge and trapping states in the film rather than fast interfacial states and leads to lower breakdown voltages and higher dielectric constants. Drift behavior of these films suggest that, with a native oxide in place, the former type of ion bombardment induced damage can be eliminated by a forming gas anneal although some deterioration of the electrical bulk properties remains.