Effects of Bonding Wires and Epoxy Molding Compound on Gold and Copper Ball Bonds Intermetallic Growth Kinetics in Electronic Packaging

Gan, Chong Leong; Classe, F. C.; Chan, B. L.; Hashim, U.

doi:10.1007/s11664-014-3011-y

Cited by 22 publications

(4 citation statements)

References 22 publications

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“…The gold-plated layer of the PAC wire strengthened the bond and maintained low resistivity characteristics after sulfurization testing, suggesting that the presence of precious metal elements may contribute to the bonding performance of Cu wire. It has been discovered that different molding compounds also have an impact on the growth rate of IMCs [55]. Various phases of Cu-Al IMCs have been identified as CuAl2, CuAl, Cu4Al3, Cu3Al2, Cu9Al4, and Cu3Al [56][57][58][59].…”

Section: Influence Of Imcs On the Reliability Of Cu Wire Bondingmentioning

confidence: 99%

Copper Wire Bonding: A Review

et al. 2023

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This paper provides a comprehensive review on copper (Cu) wire bonding. Firstly, it introduces the common types of Cu wire available in the market, including bare Cu wire, coated Cu wire, insulated Cu wire, and alloyed Cu wire. For each type, their characteristics and application areas are discussed. Additionally, we provide detailed insights into the impact of Free Air Ball (FAB) morphology on bonding reliability, including its effect on bond strength and formation mechanisms. Next, the reliability of Cu wire bonding is analyzed, with a focus on the impact of intermetallic compounds and corrosion on bonding reliability. Specifically, the formation, growth, and stability of intermetallic compounds at bonding interfaces are discussed, and their effects on bonding strength and reliability are evaluated. The detrimental mechanisms of corrosion on Cu wire bonding and corrosion inhibition methods are also analyzed. Subsequently, the applications of simulation in Cu wire bonding are presented, including finite element analysis and molecular dynamics simulations, which provide important tools for a deeper understanding of the bonding process and failure mechanisms. Finally, the current development status of Cu wire bonding is summarized, and future research directions are discussed.

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Section: Influence Of Imcs On the Reliability Of Cu Wire Bondingmentioning

confidence: 99%

Copper Wire Bonding: A Review

et al. 2023

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“…Then for this thermosetting polymer, in addition to the composition of the polymer matrix, a good combination of chemical, thermal, electrical and mechanical properties (Liu et al, 2004;Tsai et al, 2006) must be optimised to reach the maximum of packaging target properties. Two main aspects must be considered: the specific properties of the material (Bae et al, 2004;Zhang & Wong, 2004) but also the reliability of the package (Lu et al, 2009;Noijen et al, 2009;Tachapitunsuk et al, 2017;Oh et al, 2019) in contact with the semiconductor chip (Gan et al, 2014). Usually, the epoxy material is used for its good fluidity (Linec & Mušič, 2019), curing property and the capability to design integrated 3D shapes.…”

Section: Introductionmentioning

confidence: 99%

Quantitative mapping of high modulus materials at the nanoscale: comparative study between atomic force microscopy and nanoindentation

Germanicus

Mercier

Agrebi

et al. 2020

Journal of Microscopy

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Summary Local mechanical properties of submicron features are of particular interest due to their influence on macroscopic material performance and behaviour. This study is focused on local nanomechanical measurements, based on the latest Atomic Force Microscopy (AFM) mode, where the peak force set point is finely controlled at each pixel. After probe calibration, we evaluate the impact of spring constant of two AFM hand‐crafted natural full diamond tips with steel cantilevers, used for mapping. Based on the fast capture of the cantilever deflection at each pixel and real time force curve analysis in the elastic region, AFM local measured contact moduli mappings of the silica beads (>50 GPa) incorporated in an epoxy resin matrix, are compared with those determined using classical instrumented nanoindentation tests. Our analyses show that with the two AFM probes, without local residual deformation, the high moduli of the silica beads measured with this advanced AFM mode are within the standard deviation of the values determined by classical nanoindentation. Lay Description The knowledge of material properties at the nanometer scale is a key parameter for well understanding and determining the behavior of material at macroscopic scale. In this paper, we compare two methods (an advanced mode and a classical one) based on the analysis of probes in interaction with the surface of studied material. We focus on a latest developed mode for determining local mechanical properties with a very high spatial resolution. For the advanced mode, we also consider two different hand‐crafted probes. Our analyses show that with the high spatial resolution advanced mode, local mechanical properties are well determined. We also highlight the impact of the properties of the used probes for this advanced mode. In a final step, the power of the presented investigation lies in the fact that it does not modify the topography of the surface.

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“…Exposure to elevated temperatures causes intermetallic coverage to grow vertically and also laterally if coverage immediately after ball bonding is low. The kinetics of intermetallic growth at elevated temperatures has been investigated from the early days of wire bonding because of an apparent relationship between intermetallic growth kinetics and reliability (Chen, 1967; Takei and Francombe, 1968; Francombe et al , 1968; Philofsky, 1970; Hund and Plunkett, 1985; Maiocco et al , 1990; Koeninger et al , 1995; Dittmer et al , 2001; Breach et al , 2004; Breach and Wulff, 2004; Gam et al , 2006; Gan et al , 2014).…”

Section: Introductionmentioning

confidence: 99%

“…It is a common practice in studies of intermetallic growth in gold ball bonds to assume that at constant temperature the squared intermetallic thickness increases linearly with time (Kim et al , 2004; Gam et al , 2006; Gan et al , 2014); it is a behaviour predicted by models of interdiffusion between bulk single crystals of dissimilar metals (Dybkov, 2002; Mehrer, 2007) and often referred to as the parabolic model. The mathematical form of the parabolic model is shown in equation (1) where x 0 is the intermetallic thickness immediately after bonding, K (T) is a parameter with the dimensions of a diffusion constant (e.g.…”

Section: Introductionmentioning

confidence: 99%

Intermetallic growth kinetics in gold ball bonds on Al-1%Si-0.5%Cu bond pads at 175^∘C

Breach

2019

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Purpose The purpose of this study is to demonstrate that isothermal intermetallic growth data for gold ball bonds can be non-parabolic with explanations of why deviation from parabolic kinetics may occur. Design/methodology/approach Intermetallic thickness measurements were made at the centre of cross-sectioned ball bonds that were isothermally annealed at 175°C. Intermetallic growth kinetics were modelled with a power law expression(x(t) − x0)2 = α1tα2. The parameters of the power law model were obtained by transformation of the response and explanatory variables followed by data fitting using simple linear regression (SLR). Findings Ball bonds made with 4 N (99.99%Au) and 3 N (99.9%Au) gold wires exhibited two consecutive time regimes of intermetallic growth denoted Regime I and Regime II. Regime I was characterised by reactive diffusion between the gold wire and the aluminium alloy bond pad, during which Al was completely consumed in the formation of Au–Al intermetallics with non-parabolic kinetics. In Regime II, the absence of a free supply of Al to sustain intermetallic growth led to the conclusion that thickening of intermetallics was caused by phase transformation of Au8Al3 to Au4Al. Ball bonds made with 2 N (99%Au) wire also exhibited non-parabolic kinetics in Regime I and negligible intermetallic thickening in Regime II. Research limitations/implications The analysis of intermetallic growth is limited to total intermetallic growth at a single temperature (175°C). Originality/value The value of this study lies in showing that the assumption that only parabolic intermetallic growth is observed in isothermally aged gold ball bonds is incorrect. Furthermore there is no need to assume parabolic growth kinetics because with an appropriate data transformation, followed by fitting the data to a power law model using SLR and with the use of statistical diagnostics, both the suitability of the kinetic model and the nature of the growth kinetics (parabolic or non-parabolic) can be determined.

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Effects of Bonding Wires and Epoxy Molding Compound on Gold and Copper Ball Bonds Intermetallic Growth Kinetics in Electronic Packaging

Cited by 22 publications

References 22 publications

Copper Wire Bonding: A Review

Copper Wire Bonding: A Review

Quantitative mapping of high modulus materials at the nanoscale: comparative study between atomic force microscopy and nanoindentation

Intermetallic growth kinetics in gold ball bonds on Al-1%Si-0.5%Cu bond pads at 175^∘C

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Effects of Bonding Wires and Epoxy Molding Compound on Gold and Copper Ball Bonds Intermetallic Growth Kinetics in Electronic Packaging

Cited by 22 publications

References 22 publications

Copper Wire Bonding: A Review

Copper Wire Bonding: A Review

Quantitative mapping of high modulus materials at the nanoscale: comparative study between atomic force microscopy and nanoindentation

Intermetallic growth kinetics in gold ball bonds on Al-1%Si-0.5%Cu bond pads at 175∘C

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Product

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Intermetallic growth kinetics in gold ball bonds on Al-1%Si-0.5%Cu bond pads at 175^∘C