Effects of Cu content and mechanical alloying parameters on the preparation of W–Cu composite coatings on copper substrate

Development and Investigation of Tungsten Copper Sintered Parts for Using in Medium and High Voltage Switching Devices

“…W-Cu materials are of a major interest for thermal-electrical applications like electrical contacts used in low voltage (LV), medium voltage (MV) and high voltage (HV) switching devices working in vacuum, sulfur hexafluoride (SF 6 ) gas or oil [1][2][3][4][5][6][7][8][9][10][11][12][13][14].…”

“…W-Cu materials are commonly used for arcing contacts in SF 6 gas or oil CBs for MV and HV applications [5][6][7][8][9][10][11][12][13][14]. Functional properties of W-Cu materials are influenced by their microstructure and physical, electrical, thermal and mechanical properties.…”

“…W-Cu composites are considered as pseudo-alloys and advanced engineering materials due to their specific physical, electrical, thermal and mechanical properties. W-Cu powder mixtures are produced by various methods, from which the common methods are mechanical mixing, mechanical alloying and high energy ball milling of elemental powders in dry or wet conditions [2][3][4][5][6][7][8][9][10][11][12][13][14].…”

“…W-Cu composites with a W content of over 50 wt.%, balance being Cu are manufactured by liquid phase sintering of a pressed W-Cu powder mixture or by pressing-sintering-infiltration (P-S-I) that implies molten Cu infiltration into single pressed and sintered W or W-Cu skeleton with low Cu content [5,[8][9][10][11][12][13][14][15]. The porous skeleton is filled up with liquid Cu through capillary force since Cu acts as a filling agent of pores [15].…”

The Effects of Sintering Temperature on the Densification of Mechanically Alloyed W-Brass Composites

“…The densification of W-Cu is a very difficult process due to mutual insolubility or negligible solubility, poor wettability and high contact angle that leads to poor sinterability [2] [8] [15]. For the purpose of reducing the contact angle and the wetting ability of these composites, sintering activators like Ni, Co, Fe and Pd are added to the W-Cu composites in smaller proportion [3] [16]. The disadvantage of adding activators is that they reduce/deteriorate the electrical and thermal properties of these composites.…”