Effects of current stressing on the p-Bi2Te3/Sn interfacial reactions

Chan, Hsing-Ting; Chen, Lin; Yen, Yee‐Wen; Chen, Chih‐Ming

doi:10.1016/j.jallcom.2016.01.204

Cited by 10 publications

(3 citation statements)

References 24 publications

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“…A Sn-based solder is commonly applied for bonding the Bi 2 Te 3 -based thermoelectric components and Cu electrodes, as its melting point is at 220°C higher than operating temperature, and smaller than boiling point of materials [11]. Nevertheless, brittle intermetallic compounds form at the bonding interface owing to the interdiffusion between Sn from the solder and Te from the thermoelectric material [12][13][14][15]. This is a major cause of degradation in the performance and mechanical strength of thermoelectric modules.…”

Section: Introductionmentioning

confidence: 99%

Ni–W–P layer-induced strength improvement of solder joint in Bi₂Te₃ thermoelectric module

Bae

Nguyen

Son

2023

Science and Technology of Welding and Joining

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In this study, we examined the thermal stability, bonding strength, and interfacial characteristic of a Ni-W-P coating applied for solder joint of Bi 2 Te 3 thermoelectric modules. This layer had uniform thickness and was confirmed to be amorphous even after annealing at 200°C for 150 h, demonstrating its thermal stability. Moreover, the barrier layer hindered the interdiffusion between Sn and Te, eliminating the formation of brittle intermetallic at the solder joint. Thus, the bonding strengths of p-and n-type thermoelectric units were improved approximately 1.3and 2.8-fold, respectively, compared to the bonding strengths obtained without a Ni-W-P layer. In addition, the bonding strength was not affected by heating at 200°C for 150 h. The reliability of bonding strength was caused by the excellent thermal stability, and solder wettability of the barrier layer, which resulted in a bonding interface without brittle intermetallic and defects.

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Section: Introductionmentioning

confidence: 99%

Ni–W–P layer-induced strength improvement of solder joint in Bi₂Te₃ thermoelectric module

Bae

Nguyen

Son

2023

Science and Technology of Welding and Joining

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“…Among them, Sn-rich solder, which contains considerable amounts of Sn in the solder matrixes, is widely adopted in solder joints that are assembled via under-bump metallization (UBM), using a solder alloy and intermetallic compound (IMC) at the interface between the solder and the UBM method via a reflow process at a suitable temperature [ 16 , 17 , 18 ]. The reliability issues of Sn-rich solder joints have drawn substantial concerns, the first of which is the EM reliability during a consistent electron flow with a critical current density in Sn-rich solder joints [ 19 , 20 , 21 ], inducing UBM dissolution, rapid IMC growth, void formation, and severe Joule heating [ 22 , 23 , 24 , 25 ]. Then, the Joule heating induces a temperature gradient in the solder joint, known as the TM [ 22 , 26 , 27 , 28 ].…”

Section: Introductionmentioning

confidence: 99%

Effect of Sn Grain Orientation on Reliability Issues of Sn-Rich Solder Joints

Shen

2022

Materials

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Sn-rich solder joints in three-dimensional integrated circuits and their reliability issues, such as the electromigration (EM), thermomigration (TM), and thermomechanical fatigue (TMF), have drawn attention related to their use in electronic packaging. The Sn grain orientation is recognized as playing an important role in reliability issues due to its anisotropic diffusivity, mechanical properties, and coefficient of thermal expansion. This study reviews the effects of the Sn grain orientation on the EM, TM, and TMF in Sn-rich solder joints. The findings indicate that in spite of the failure modes dominated by the Sn grain orientation, the size and shape of the solder joint, as well as the Sn microstructures, such as the cycling twining boundary (CTB), single crystals, and misorientations of the Sn grain boundary, should be considered in more detail. In addition, we show that two methods, involving a strong magnetic field and seed crystal layers, can control the Sn grain orientations during the solidification of Sn-rich solder joints.

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“…[7][8][9][10][11] The brittle SnTe phase shows a fast growth rate, 12 so a thick SnTe phase can easily form at the solder/Bi 2 Te 3 joints which degrades the solder joints mechanically. To suppress the SnTe formation, a Ni diffusion barrier is usually deposited on the Bi 2 Te 3 elements prior to soldering.…”

Section: Introductionmentioning

confidence: 99%

Electrodeposition of Ni on Bi2Te3 and Interfacial Reaction Between Sn and Ni-Coated Bi2Te3

Tseng

Lee

Hau

et al. 2017

Journal of Elec Materi

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Bismuth-telluride (Bi 2 Te 3 )-based compounds are common thermoelectric materials used for low-temperature applications, and nickel (Ni) is usually deposited on the Bi 2 Te 3 substrates as a diffusion barrier. Deposition of Ni on the p-type (Sb-doped) and n-type (Se-doped) Bi 2 Te 3 substrates using electroplating and interfacial reactions between Sn and Ni-coated Bi 2 Te 3 substrates are investigated. Electrodeposition of Ni on different Bi 2 Te 3 substrates is characterized based on cyclic voltammetry and Tafel measurements. Microstructural characterizations of the Ni deposition and the Sn/Ni/Bi 2 Te 3 interfacial reactions are performed using scanning electron microscopy. A faster growth rate is observed for the Ni deposition on the n-type Bi 2 Te 3 substrate which is attributed to a lower activation energy of reduction due to a higher density of free electrons in the n-type Bi 2 Te 3 material. The common Ni 3 Sn 4 phase is formed at the Sn/Ni interfaces on both the p-type and n-type Bi 2 Te 3 substrates, while the NiTe phase is formed at a faster rate at the interface between Ni and n-type Bi 2 Te 3 substrates.

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Effects of current stressing on the p-Bi2Te3/Sn interfacial reactions

Cited by 10 publications

References 24 publications

Ni–W–P layer-induced strength improvement of solder joint in Bi₂Te₃ thermoelectric module

Ni–W–P layer-induced strength improvement of solder joint in Bi₂Te₃ thermoelectric module

Effect of Sn Grain Orientation on Reliability Issues of Sn-Rich Solder Joints

Electrodeposition of Ni on Bi2Te3 and Interfacial Reaction Between Sn and Ni-Coated Bi2Te3

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Effects of current stressing on the p-Bi2Te3/Sn interfacial reactions

Cited by 10 publications

References 24 publications

Ni–W–P layer-induced strength improvement of solder joint in Bi2Te3 thermoelectric module

Ni–W–P layer-induced strength improvement of solder joint in Bi2Te3 thermoelectric module

Effect of Sn Grain Orientation on Reliability Issues of Sn-Rich Solder Joints

Electrodeposition of Ni on Bi2Te3 and Interfacial Reaction Between Sn and Ni-Coated Bi2Te3

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Ni–W–P layer-induced strength improvement of solder joint in Bi₂Te₃ thermoelectric module

Ni–W–P layer-induced strength improvement of solder joint in Bi₂Te₃ thermoelectric module