Effects of FeCo magnetic nanoparticles on microstructure of Sn-Ag-Cu alloys

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Effects of FeCo magnetic nanoparticles on microstructure of Sn-Ag-Cu alloys

Abstract: The interfacial amorphous double layer and the homogeneous nucleation in reflow of a Sn-Zn solder on Cu substrate

Cited by 6 publications

References 22 publications

Recent progress of Sn–Ag–Cu lead-free solders bearing alloy elements and nanoparticles in electronic packaging

Recent progress of Sn–Ag–Cu lead-free solders bearing alloy elements and nanoparticles in electronic packaging

Development of lead-free interconnection materials in electronic industry during the past decades: Structure and properties

Magnetic nanoparticle-based solder composites for electronic packaging applications

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