Effects of microstructure on mechanical properties of CuNiSi alloys

Gholami, M.; Veselý, Jozef; Altenberger, I.; Kuhn, H.-A.; Janeček, Miloš; Wollmann, Manfred; Wagner, Lothar

doi:10.1016/j.jallcom.2016.11.233

Cited by 82 publications

(24 citation statements)

References 45 publications

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“…Figure 8a shows that the lobe-lobe contrast Cr precipitates can also be defected in CuNiCrSi-BM. However, the reflection spots of Cr precipitates cannot be found from the relevant SDA pattern (Figure 8b (Figure 8d) reveal the precipitates have a δ-Ni2Si crystal structure [2]. However, it is similar to samples from CuCrZr-NZ, no precipitates are detected in samples from CuNiCrSi-NZ based on bright field TEM micrographs (Figure 8e) and relevant SAD pattern (Figure 8f).…”

Section: Conditionsmentioning

confidence: 93%

“…The ultimate tensile strength (UTS) and electrical conductivity of CuCrZr alloy can reach to more than 530 MPa and 80% IACS [1]. In comparison, the CuNiCrSi alloy shows a higher ultimate tensile strength of 600-800 MPa but a lower electrical conductivity of about 45% IACS due to different additions [2]. The dissimilar joints of CuCrZr and CuNiCrSi alloy with good balance of strength and electrical conductivity can be widely applied to many industries, such as large generator rotor and international thermo nuclear experiment reactor (ITER) components [3,4].…”

Section: Introductionmentioning

confidence: 99%

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Microstructure and Mechanical Characterization of a Dissimilar Friction-Stir-Welded CuCrZr/CuNiCrSi Butt Joint

Sun

Xue

et al. 2018

Metals

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Dissimilar CuNiCrSi and CuCrZr butt joints were successfully frictionstirwelded at constant welding speed of 150 mm/min and rotational speed of 1400 rpm with the CuCrZr alloy or the CuNiCrSi alloy located on the advancing side (AS). The microstructure and mechanical properties of joints were investigated. When the CuCrZr alloy was located on the AS, the area of retreating material in the nugget zone was a little bigger. The Cr solute-rich particles were found in the nugget zone on CuCrZr side (CuCrZr-NZ) while a larger density of solute-rich particles identified as the concentration of Cr and Si element was found in the nugget zone on CuNiCrSi side (CuNiCrSi-NZ). The Cr precipitates and δ-Ni 2 Si precipitates were found in the base metal on CuNiCrSi side (CuNiCrSi-BM) but only Cr precipitates can be observed in the base metal on CuCrZr side (CuCrZr-BM). Precipitates were totally dissolved into Cu matrix in both CuCrZr-NZ and CuNiCrSi-NZ, which led to a sharp decrease in both micro-hardness and tensile strength from BM to NZ. When the CuNiCrSi was located on the AS, the tensile testing results showed the fracture occurred at the CuCrZr-NZ, while the fracture was found at the mixed zone of CuNiCrSi-NZ and CuCrZr-NZ for the other case.

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Section: Conditionsmentioning

confidence: 93%

Section: Introductionmentioning

confidence: 99%

Microstructure and Mechanical Characterization of a Dissimilar Friction-Stir-Welded CuCrZr/CuNiCrSi Butt Joint

Sun

Xue

et al. 2018

Metals

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“…Wang et al [56] researched Cu-7.4Ni-1.3Si-1.2Cr (wt.%) alloy produced by powder metallurgy and found that the optimal heat-treated Cu alloy (solution heat treatment at 970°C for 8 h followed by aging at 450°C for 6 h) had a tensile strength up to 820 MPa and an average thermal conductivity up to 110 W m K −1 , as shown in Figure 9. Gholami et al [57] used swaging to generate an ultrafinegrained microstructure in Cu-2.5Ni-0.5Si-0.06Mg (wt.%) alloy, along with an optimized precipitation hardening. As a result, an elongation to fracture of 14% and tensile strength of 800-900 MPa were achieved.…”

Section: Cu-ni-si Systemmentioning

confidence: 99%

High strength and high conductivity Cu alloys: A review

Yang

Lei

et al. 2020

Sci. China Technol. Sci.

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High strength and high conductivity (HSHC) Cu alloys are widely used in many fields, such as high-speed electric railway contact wires and integrated circuit lead frames. Pure Cu is well known to have excellent electrical conductivity but rather low strength. The main concern of HSHC Cu alloys is how to strengthen the alloy efficiently. However, when the Cu alloys are strengthened by a certain method, their electrical conductivity will inevitably decrease to a certain extent. This review introduces the strengthening methods of HSHC Cu alloys. Then the research progress of some typical HSHC Cu alloys such as Cu-Cr-Zr, Cu-Ni-Si, Cu-Ag, Cu-Mg is reviewed according to different alloy systems. Finally, the development trend of HSHC Cu alloys is forecasted. It is pointed out that precipitation and micro-alloying are effective ways to improve the performance of HSHC Cu alloys. At the same time, the production of HSHC Cu alloys also needs to comply with the large-scale, low-cost development trend of industrialization in the future.

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“…Copper is also widely used for bolts, nuts, valves, and fittings due to its excellent ductility and malleability (Nnakwo, 2017). Copper is mostly alloyed with silicon and other elements such as tungsten, zinc, tin, magnesium, manganese and nickel to gain high strength and hardness without much reduction of its conductivity (Nnakwo, 2017;Nnakwo et al, 2017aNnakwo et al, , 2017b2019a, 2019bNnakwo and Nnuka, 2018;Garbacz-Klempka et al, 2018;Qing et al, 2011;Xie et al, 2003;Lei et al, 2013aLei et al, , 2013bLei et al, , 2017Gholami et al, 2017;Qian et al, 2017;Suzuki et al, 2006;Wang et al, 2016;Li et al, 2009Li et al, , 2017Pan et al, 2007;Eungyeong et al, 2011;Ho et al, 2000). Silicon increases the fluidity and hardness of copper at the expense of ductility and electrical conductivity by inducing the precipitation of hard but brittle phases such as Cu 3 Si (ɳ I ), Cu 15 Si 4 (ε), and Cu 5 Si (ɣ) when cooled slowly to ambient temperature (Pak et al, 2016;Mattern et al, 2007).…”

Section: Introductionmentioning

confidence: 99%

Influence of trace additions of titanium on grain characteristics, conductivity and mechanical properties of copper-silicon-titanium alloys

Nnakwo

Mbah

Nnuka

2019

Heliyon

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The main objective of this research is to explore the influence of trace additions of titanium on grain characteristics (morphology and size), conductivity, and mechanical properties of copper-silicon-titanium alloys. The alloys compositions were designed using response surface optimal design (RSOD). The designed alloy compositions were melted, cast, and subjected to normalizing heat treatment at 900 C for 0.5 hr. The grain characteristics and the elemental constituents of the produced alloys were analyzed using an optical microscope (OM), scanning electron microscopy (SEM), and x-ray fluorescence spectroscopy. The average grain size and distribution were also determined. The properties investigated were percentage elongation, tensile strength, hardness, electrical conductivity, and density. The results were analyzed statistically using analysis of variance (ANOVA) to obtain the significance of titanium content on the tested properties and to generate statistical model equations for future applications. The experimental results were optimized to ascertain the optimal alloy composition and properties. The OM and SEM results revealed a decrease in the average grain size of the parent alloy (Cu-3Si) from %10.1 μm to %4.4 μm and change in grain morphology after adding titanium, leading to improvement of properties. The results were confirmed to be statistically significant. The optimization results revealed Cu-3Si-0.47wt%Ti as the optimal alloy composition.

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Effects of microstructure on mechanical properties of CuNiSi alloys

Cited by 82 publications

References 45 publications

Microstructure and Mechanical Characterization of a Dissimilar Friction-Stir-Welded CuCrZr/CuNiCrSi Butt Joint

Microstructure and Mechanical Characterization of a Dissimilar Friction-Stir-Welded CuCrZr/CuNiCrSi Butt Joint

High strength and high conductivity Cu alloys: A review

Influence of trace additions of titanium on grain characteristics, conductivity and mechanical properties of copper-silicon-titanium alloys

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