Effects of Ni-decorated reduced graphene oxide nanosheets on the microstructural evolution and mechanical properties of Sn-3.0Ag-0.5Cu composite solders

Zhang, Hehe; Xiao, Yuchen; Xu, Zhihai; Yang, Ming-Feng; Zhang, Liping; Yin, Limeng; Chai, Sensen; Wang, Gang; Zhang, Long; Cai, Xinnan

doi:10.1016/j.intermet.2022.107683

Cited by 92 publications

(22 citation statements)

References 28 publications

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“…Hehe et al [16] investigated the effect of Ni-decorated reduced graphene oxide nanosheets (Ni-RGO) addition on the mechanical characteristics and microstructural changes of Sn-3.0Ag-0.5Cu composite solders. The powder metallurgy technique was used to fabricate xNiRGO/SAC305 composite solders (x = 0, 0.01, 0.03, 0.05, 0.07, and 0.1 wt%).…”

Section: Introductionmentioning

confidence: 99%

Effects of TiO₂, CuO, and SiO₂ nanoparticles addition on the microstructure and mechanical properties of Al-10 wt% Zn alloy

AbdElRhiem,

Mostafa,

Nada

et al. 2023

Phys. Scr.

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This paper presents the effects of adding TiO2, CuO, and SiO2 (1 wt%) nanoparticles on the microstructure and mechanical properties of Al-10 wt% Zn alloy. A set of composite alloys was produced by incorporating SiO2, CuO, and TiO2 nanoparticles to the Al-10 wt% Zn alloy. Optical microscope (OM), scanning electron microscope (SEM) fitted with an Energy Dispersive Spectroscope (EDS), and X-ray diffraction (XRD) were used to investigate the microstructure of these alloys. The mechanical properties of the composite solders were assessed using the Vickers hardness tests. After a solution heat treatment at 500 K for 2 h, samples were immediately aged at 373 to 473 K for 2 h, followed by water quenching at 300 K. The experimental data indicated that Al-10 wt% Zn-1wt% SiO2 samples had the highest hardness values among all investigated composite alloys. The calculated porosity percentages of the composite alloys revealed that the Al-10 wt% Zn-1 wt% SiO2 samples had the lowest percentage. This finding can be attributed to the fact that these samples demonstrated the highest hardness values. The hardness of all composite alloys decreased with increasing the aging temperature with anomalous behavior at 443 K, where they had abnormally high values. The observed differences in the mean crystallite size, lattice strain, and dislocation density of the composite alloys, calculated from XRD data with increasing aging temperature, are attributed to the precipitation in Al-Zn alloys. The calculated values of the stress exponent and activation energy of composite alloys may be associated with grain boundary diffusion (GBD) as the dominant operating mechanism.

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Section: Introductionmentioning

confidence: 99%

Effects of TiO₂, CuO, and SiO₂ nanoparticles addition on the microstructure and mechanical properties of Al-10 wt% Zn alloy

AbdElRhiem,

Mostafa,

Nada

et al. 2023

Phys. Scr.

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“…The eutectic structure includes the granular β−Sn + Cu 6 Sn 5 and needlelike β−Sn + Ag 3 Sn binary eutectic structure and the β−Sn + Cu 6 Sn 5 + Ag 3 Sn ternary eutectic structure. According to the EDS analysis of Region B in Figure 3 b,d, C−atom−rich Ni−GNSs nanoparticles are non−uniformly distributed in the solder seam near the interfacial IMC [ 43 ].…”

Section: Resultsmentioning

confidence: 99%

Study on Microstructure and Mechanical Properties at Constant Electromigration Temperature of Sn2.5Ag0.7Cu0.1RE0.05Ni-GNSs/Cu Solder Joints

Zhang

Gao

et al. 2023

Materials

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To solve the electromigration problem of micro−electronic connection solder joints, an ideal electromigration tester was designed, and the thickness of the intermetallic compounds (IMCs), average void diameter, grain orientation, failure, shear strength, and fracture path of Sn2.5Ag0.7Cu0.1RE0.05Ni−GNSs/Cu solder joints under constant−temperature electromigration were studied. The results indicate that the solder joints show evidence of typical electromigration polarity in the asymmetric growth of interfacial IMCs on the anode and cathode sides under the conditions of a current density ≥7 × 103 A/cm2 and an included angle between the c−axis of the β−Sn grains and the current direction θ ≤ 53.2°. The anode−side interfacial IMC is dominated by a Cu6Sn5 phase with a gradually increasing thickness, forming a Cu3Sn phase and showing evidence of microcracks. The Cu6Sn5 phase of the cathode−side interfacial IMC is gradually completely dissolved, and the growth of the Cu3Sn phase is accompanied by the formation of Kirkendall voids. The anisotropic diffusion of Cu atoms in the β−Sn of the micro−solder joints causes increased solder joint resistance and reduced shear strength. The shear fracture path of the solder joints moves from the cathode side near the IMC solder seam to the Cu3Sn interface. The shear fracture mechanism changes from ductile transgranular fracture dominated by β−Sn dimples to brittle fracture dominated by interfacial IMC cleavage and slip steps.

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“…[ 11 ], winding process (tension, speed, yarn number, etc.) [ 12 , 13 ], and other factors [ 14 , 15 , 16 , 17 , 18 ] on COPV properties.…”

Section: Introductionmentioning

confidence: 99%

Optimization of the Winding Layer Structure of High-Pressure Composite Overwrapped Pressure Vessels

Zhu

Guo

et al. 2023

Materials

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The large thickness COPV is designed by netting theory and the finite element simulation method, but the actual performance is low and the cylinder performance still cannot be improved after increasing the thickness of the composite winding layer. This paper analyzes the reasons for this and puts forward a feasible solution: without changing the thickness of the winding layer, the performance of COPV can be effectively increased by increasing the proportion of annular winding fiber. This method has been verified by tests and is supported by theory.

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Effects of Ni-decorated reduced graphene oxide nanosheets on the microstructural evolution and mechanical properties of Sn-3.0Ag-0.5Cu composite solders

Cited by 92 publications

References 28 publications

Effects of TiO₂, CuO, and SiO₂ nanoparticles addition on the microstructure and mechanical properties of Al-10 wt% Zn alloy

Effects of TiO₂, CuO, and SiO₂ nanoparticles addition on the microstructure and mechanical properties of Al-10 wt% Zn alloy

Study on Microstructure and Mechanical Properties at Constant Electromigration Temperature of Sn2.5Ag0.7Cu0.1RE0.05Ni-GNSs/Cu Solder Joints

Optimization of the Winding Layer Structure of High-Pressure Composite Overwrapped Pressure Vessels

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Effects of Ni-decorated reduced graphene oxide nanosheets on the microstructural evolution and mechanical properties of Sn-3.0Ag-0.5Cu composite solders

Cited by 92 publications

References 28 publications

Effects of TiO2, CuO, and SiO2 nanoparticles addition on the microstructure and mechanical properties of Al-10 wt% Zn alloy

Effects of TiO2, CuO, and SiO2 nanoparticles addition on the microstructure and mechanical properties of Al-10 wt% Zn alloy

Study on Microstructure and Mechanical Properties at Constant Electromigration Temperature of Sn2.5Ag0.7Cu0.1RE0.05Ni-GNSs/Cu Solder Joints

Optimization of the Winding Layer Structure of High-Pressure Composite Overwrapped Pressure Vessels

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Product

Resources

About

Effects of TiO₂, CuO, and SiO₂ nanoparticles addition on the microstructure and mechanical properties of Al-10 wt% Zn alloy

Effects of TiO₂, CuO, and SiO₂ nanoparticles addition on the microstructure and mechanical properties of Al-10 wt% Zn alloy