Effects of Silver Coating Covered with Copper Filler on Electrical Resistivity of Electrically Conductive Adhesives

Abstract

Electrically conductive adhesives (ECAs) are usually composed of conductive metal fillers and polymeric resin. For the metals fillers, silver is the most commonly used due to its high electrical and thermal conductivities, and chemical stability. Recently copper can be a promising candidate for conductive filler metal due to its low resistivity, low cost and good electro-migration performance. In this study, to overcome the problem of high electrical resistance associated with the oxidation of copper, copper particles were coated with silver, and the silver-coated copper was tested as a filler metal. In particular, the effect of silver coating on the electrical resistivity of ECAs just after curing and after reliability tests was investigated. It was found that the electrical resistivity of ECA using silver-coated copper filler was much lower and more stable than that of ECA using pure copper filler after curing and after reliability tests.

Spontaneous Deposition of Ultrathin Ag Shell on Cu Nanoparticle Core Using Galvanic Replacement

“…To our knowledge, the diameters of the Cu particles reported so far are larger than 1 μm. 9,10,12,[15][16][17]19 Most of the Ag films on Cu microparticles are agglomerates of small Ag spherical nanoparticles in general. Even on Cu nanoparticles, Ag films of spherical nanoparticle agglomerates were observed.…”

“…There are a few ways to produce Cu@Ag core-shell nanoparticles such as electroplating, 7 vacuum process, 8 and electroless plating (galvanic replacement). [9][10][11][12][13][14][15][16][17][18][19][20] The former two methods have disadvantages of low efficiency, complicated procedure, and excessive use of chemicals. Contrastingly, the galvanic replacement method is advantageous because it is relatively simple and efficient.…”

Cross Testing Electrically Conductive Adhesives and Conductive Back-sheets for the ECN Back-contact Cell and Module Technology

“…The silver content was reduced from over 80 wt-% to less than 20 wt-% in a few years' time by replacing the silver particles by silver coated metal particles. ECAs with even lower silver content are under development [10] and will be tested in back-contact modules.…”

Proton-assisted low-temperature sintering of Cu fine particles stabilized by a proton-initiating degradable polymer

“…Moreover, it is not magnetic. Many efforts on the use of inks and pastes of copper particles [20][21][22][23][24][25][26][27][28][29][30][31][32][33][34] and copper organo-complexes [35][36][37][38][39] have been made to develop low-temperature sintering processes including photo and laser irradiation sintering. [40][41][42] However, copper ne particles get oxidized easily even under ambient conditions and this problem limits their application.…”