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Electrically conductive adhesives (ECAs) are usually composed of conductive metal fillers and polymeric resin. For the metals fillers, silver is the most commonly used due to its high electrical and thermal conductivities, and chemical stability. Recently copper can be a promising candidate for conductive filler metal due to its low resistivity, low cost and good electro-migration performance. In this study, to overcome the problem of high electrical resistance associated with the oxidation of copper, copper particles were coated with silver, and the silver-coated copper was tested as a filler metal. In particular, the effect of silver coating on the electrical resistivity of ECAs just after curing and after reliability tests was investigated. It was found that the electrical resistivity of ECA using silver-coated copper filler was much lower and more stable than that of ECA using pure copper filler after curing and after reliability tests.

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The MMR system with three-dimensional fusion imaging can reduce the contrast medium dose in EVAR and the exposure to contrast medium and radiation in TEVAR.

No abstract