2012
DOI: 10.1179/1433075x12y.0000000002
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Effects of sputtering pressure on properties of Al doped ZnO thin films dynamically deposited by rf magnetron sputtering

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Cited by 13 publications
(5 citation statements)
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“…Tseng et al [101] also reported that the grain size of gallium-doped ZnO films by RF magnetron sputtering decreased with the sputtering pressure, as shown in figure 9. This was consistent with the results of Zhou et al [102] that the deposition rate and grain size of Al doped ZnO thin films deposited by RF magnetron sputtering typically decreased with the gas pressure. Seshan [89] found that the best deposition probability (highest) occurred for low pressure, short throw distances and a gas species that was lighter than the sputtered species, resulting in the best deposition rate at low pressure.…”
Section: Effects Of Different Gas Pressures On the Surface Roughness ...supporting
confidence: 93%
“…Tseng et al [101] also reported that the grain size of gallium-doped ZnO films by RF magnetron sputtering decreased with the sputtering pressure, as shown in figure 9. This was consistent with the results of Zhou et al [102] that the deposition rate and grain size of Al doped ZnO thin films deposited by RF magnetron sputtering typically decreased with the gas pressure. Seshan [89] found that the best deposition probability (highest) occurred for low pressure, short throw distances and a gas species that was lighter than the sputtered species, resulting in the best deposition rate at low pressure.…”
Section: Effects Of Different Gas Pressures On the Surface Roughness ...supporting
confidence: 93%
“…Furthermore, the growth rate per cycle of the AALD Al:ZnO films is 0.94 Å/cycle, corresponding to about 0.3 Å/s. This value is lower than that (0.5-3 Å/s) obtained by using sputter [28][29][30][31], but in terms of total deposition time, the AALD method would take more advantages since it does not require a vacuum environment. For example, for a 60 nm-thick Al:ZnO film, the AALD method takes about 40 min to finish the deposition, whereas the sputter technique may require more time as it needs to reach high degree of vacuum before deposition.…”
Section: Introductionmentioning
confidence: 64%
“…Similarly, for AZO films grown from a ceramic target the crystallite size increased from 8.7 to 17.7 nm for pressures ranging from 0.1 to 0.4 Pa. Moreover, Kim & Kim 14 reported crystallite sizes from 25.2 to 28.7 nm for pressures of 0.13 to 0.27 Pa. For the data of G-Berasategui et al 10 , Zhou et al 32 and Yue et al 20 grown at temperatures greater than 523K, the crystallite size is usually larger, between 30 to 70 nm.…”
Section: Composition and Structural Propertiesmentioning
confidence: 89%
“…Figure 4 shows the crystallite size as a function of the sputtering pressure. For comparison, we include several data published in the literature 10,14,20,32 . For reactive series, the crystallite size increased continuously from 8.2 to 17.3 nm for sputtering pressures ranging from 0.16 to 6.7 Pa.…”
Section: Composition and Structural Propertiesmentioning
confidence: 99%