We report on a low-temperature-processed organic thin-film transistor (OTFT) using hollow-cathode chemical vapor deposition (HC-CVD) SiO 2 as the gate insulator below a processing temperature of 100 • C. The physical properties of SiO 2 deposited using the HC-CVD are studied using various deposition temperatures, RF powers and TEOS/O 2 ratios. OTFTs with HC-CVD-deposited SiO 2 gate insulators were fabricated below 100 • C without the gate insulator surface treatment. We obtained good OTFT electrical characteristics including a threshold voltage (V TH ) of −2.9 V, a field-effect mobility (μ FE ) of 2.3 × 10 −2 cm 2 V −1 s −1 , a sub-threshold swing (SS) of 0.516 V/decade and an on/off current ratio (I on /I off ) of 1.27 × 10 5 . To our knowledge, this is the first time that the low-temperature deposition (<100 • C) of SiO 2 using the HC-CVD technique was successfully applied to OTFT gate insulator fabrication.