Effects of thermal aging on Cu nanoparticle/Bi-Sn solder hybrid bonding

Usui, Masanori; Satoh, Toshifumi; Kimura, Hidehiko; Tajima, Shogo; Hayashi, Yukimasa; Setoyama, Daigo; Kato, Masashi

doi:10.1016/j.microrel.2017.07.096

Cited by 10 publications

(6 citation statements)

References 37 publications

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“…51 For this reason, the application of the thermal stresses caused the Al of the DBA substrate to deform greatly, resulting in the formation of cracks or voids in the Ag nanoparticles or Zn-based bonding layer. In contrast, our previous study 27 revealed that high-temperature storage led to little oxidation of the bonding layer, suppressing the decrease in the mechanical strength. Accordingly, the high bonding strength reduced the Al deformation, resulting in the suppression of the hybrid bonding degradation.…”

Section: Degradation Mode Of the Thermal Cycle Stresses With A Large contrasting

confidence: 68%

“…To verify the reliable operation of power modules under high temperatures, several reliability tests, such as high-temperature storage, thermal cycles and power cycle tests, are generally required. A previous study 27 confirmed that the proposed bonding layer maintained its initial bonding strength after a high-temperature storage test (> 200°C). Although the thermal cycle test is crucial for ensuring the high-temperature operation of the power modules, few studies have undertaken thermal cycle tests for hybrid bonding.…”

Section: Introductionsupporting

confidence: 66%

“…7) shows a networklike macro-void of $ 50-lm width in the region (Y), which originates from the gas molecules caused by the solvent in the paste and the capping layer of Cu nanoparticles. 27 A comparison between Fig. 7a and b indicates that the effect of thermal cycle stress loading (À 40/250°C, 200 cycles) on region (Y) was lower than that on region (X).…”

Section: Thermal Cycle Test At Temperatures Between 2 40°c and 250°cmentioning

confidence: 94%

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Reliability of Cu Nanoparticles/Bi-Sn Solder Hybrid Bonding Under Cyclic Thermal Stresses

Usui

Satoh

Kamiyama

et al. 2021

JOM

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The influence of thermal cycle stress loading on hybrid bonding, which was formed by sintering a mixture of Cu nanoparticles and a eutectic Bi-Sn solder powder, has been investigated. A Si chip and a directly bonded aluminum (DBA) substrate were bonded using the hybrid bonding layer. The bonded sample was evaluated using a thermal cycle test (À 40°C and 250°C). The degradation process of the sample during the test was observed nondestructively using synchrotron radiation x-ray computed laminography. The thermal cycle stress loading had a minimal effect on the microstructure of the bonding layer, which has a high bonding strength owing to the liquid phase sintering and high decomposition melting temperature of the Cu-Sn compound formation. This property reduced the Al deformation of the DBA substrate caused by the thermal cycle loading, resulting in the suppression of the bonding layer degradation. Therefore, hybrid bonding can be instrumental in achieving the reliable operation of power modules at high temperatures.

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Section: Degradation Mode Of the Thermal Cycle Stresses With A Large contrasting

confidence: 68%

Section: Introductionsupporting

confidence: 66%

Section: Thermal Cycle Test At Temperatures Between 2 40°c and 250°cmentioning

confidence: 94%

See 1 more Smart Citation

Reliability of Cu Nanoparticles/Bi-Sn Solder Hybrid Bonding Under Cyclic Thermal Stresses

Usui

Satoh

Kamiyama

et al. 2021

JOM

View full text Add to dashboard Cite

show abstract

“…Little is known about the oxidation resistance of Sn-Bi solder. The effects of high-temperature aging on a novel hybrid bonding layer consisted of Cu nanoparticles and a eutectic Bi-Sn solder powder was studied by Usui et al [140]. The results show a relatively high amount of oxides in the bonding layer.…”

Section: Sn-bi Low Temperature Lead-free Soldermentioning

confidence: 99%

“… Solder Element wt. % Oxidation resistance reliability Reference ↓ [ 140 ] Sn-Bi Al 0.005 ↑ [ 141 ] Ge 0.007 ↑ √ [ 142 ] Sn-Zn Cr 0.1 ↑ [ 144 ] Ga 0.5 ↑↑ [ 145 ] Ag 0.5 ↑ [ 146 ] Ag, In 0.5, 1 ↑↑ √√ [ 146 ] Bi 1 ↑ [ 147 ] Nd 0.1 ↑ [ 148 ] Notes:↓ = slightly decreased ↓↓ = remarkably decreased ↑ = slightly increased ↑↑ = remarkably inc...…”

Section: Oxidation Resistancementioning

confidence: 99%