Effects of twin grain boundaries on the subgrain rotation of the solder joint during thermal shock

Tan, Shihai; Han, Jing; Guo, Fu

doi:10.1016/j.microrel.2017.03.013

Cited by 12 publications

(4 citation statements)

References 31 publications

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“…There are mainly three kinds of Sn grains with different crystal orientations in twin crystal solder joints and the grains are usually staggered. Polycrystalline solder joints are composed of many Sn grains with different crystal orientations and the crystal orientations of adjacent grains are quite different [16][17][18]. The failure behavior of the solder joints with the same composition during the creep tests can vary greatly due to the different crystal orientations.…”

Section: Introductionmentioning

confidence: 99%

Effect of grain boundary on failure behavior of SABI333 solder joints during creep

Zhai

Wang

et al. 2020

J Mater Sci: Mater Electron

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Sn 3.0 Ag 3.0 Bi 3.0 In (SABI333) solder is easy to form solder joints with different crystal structures during solidification. Solder joints with different crystal structures can exhibit different failure behaviors during creep. Five kinds of SABI333 solder joints with different crystal structures were selected to study the effect of grain boundary on the failure behavior of creep. The scanning electron microscopy (SEM) and electron backscattered diffraction (EBSD) were utilized to characterize the surface morphologies and crystal orientations of solder joints. When there were only low angle grain boundaries or twin boundaries in the solder joints, it was not easy to generate cracks inside the solder joints during creep but easy to generate cracks at the interfaces between the copper bars and solder matrices. However, when there were high angle grain boundaries greater than 70° in the solder joints, the cracks would propagate along such grain boundaries during creep. This phenomenon depends on the difference of grain boundary energy and the difference of deformation degrees of grains on both sides of grain boundaries during creep. The grain boundary energy of the high angle grain boundaries is relatively high and the deformation degrees of grains on both sides of high angle grain boundaries are quite different during creep. This research is conducive to further understand the creep failure behavior of SABI333 solder joints under the service environment.

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Section: Introductionmentioning

confidence: 99%

Effect of grain boundary on failure behavior of SABI333 solder joints during creep

Zhai

Wang

et al. 2020

J Mater Sci: Mater Electron

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“…Due to the size effect, the high surface activity of Ag nanoparticles (Ag-NPs) can drive the diffusive migration of silver atoms and achieve rapid structure densification at the temperature well below the melting point of bulk silver (Li et al , 2017; Yang et al , 2019; Wang and Benabou, 2020). At the same time, nano-silver paste has excellent electrical and thermal conductivity and “low-temperature sintering, high-temperature service” performance, which made its application in the field of high-temperature and high-power semiconductor have a very broad development prospect (Chen and Suganuma, 2021; Tan et al , 2017; Noh et al , 2018; Yoon and Back, 2022). Ogura et al (2010) found that repeated thermal cycling in an air atmosphere deepened the oxidation of the copper substrate in the nano-silver joints, resulting in a severe weakening of the bonding strength of the joints.…”

Section: Introductionmentioning

confidence: 99%

Microstructural and mechanical evolution of sintered nano-silver joints on bare copper substrates during high-temperature storage

Jiang,

Liu,

et al. 2023

SSMT

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Purpose The purpose of this paper is to study the reliability of sintered nano-silver joints on bare copper substrates during high-temperature storage (HTS). Design/methodology/approach In this study, HTS at 250 °C was carried out to investigate the reliability of nano-silver sintered joints. Combining the evolution of the microstructure and shear strength of the joints, the degradation mechanisms of joints performance were characterized. Findings The results indicated that the degradation of the shear properties of sintered nano-silver joints on copper substrates was attributed to copper oxidation at the silver/copper interface and interdiffusion of interfacial elements. The joints decreased by approximately 57.4% compared to the original joints after aging for 500 h. In addition, severe coarsening of the silver structure was also an important cause for joints failure during HTS. Originality/value This paper provides a comparison of quantitative and mechanistic evaluation of sintered silver joints on bare copper substrates during HTS, which is of great importance in promoting the development of sintered silver technology.

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“…However, the impact shear test of single solder bump was more convenient and economical than the board level test method. It provided important solder bump integrity and robustness information and the most useful and wide adopted measurement technique for solder bump quality and reliability assessments (Tan et al , 2017; Kim et al , 2009). With the miniaturization of solder joints, solder joints were more prone to failure under thermal shock and the impact reliability of solder joints has been paid more and more attention (Kim et al , 2006; Ha et al , 2009; Kim et al , 2007).…”

Section: Introductionmentioning

confidence: 99%

Property of Sn-37Pb solder bumps with different diameter during thermal shock

Gan

Yang

et al. 2021

SSMT

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Purpose The impact strength of solder joint under high strain rate was evaluated by board level test method. However, the impact shear test of single solder bump was more convenient and economical than the board level test method. With the miniaturization of solder joints, solder joints were more prone to failure under thermal shock and more attention has been paid to the impact reliability of solder joint. But Pb-free solder joints may be paid too much attention and Sn-Pb solder joints may be ignored. Design/methodology/approach In this study, thermal shock test between −55°C and 125°C was conducted on Sn-37Pb solder bumps in the BGA package to investigate microstructural evolution and growth mechanism of interfacial intermetallic compounds (IMCs) layer. The effects of thermal shock and ball diameter on the mechanical property and fracture behavior of Sn-37Pb solder bumps were discussed. Findings With the increase of ball size, the same change tendency of shear strength with thermal shock cycles. The shear strength of the solder bumps was the highest after reflow; with the increase of the number of thermal shocks, the shear strength of the solder bumps was decreased. But at the time of 2,000 cycles, the shear strength was increased to the initial strength. Minimum shear strength almost took place at 1,500 cycles in all solder bumps. The differences between maximum shear strength and minimum shear strength were 9.11 MPa and 16.83 MPa, 17.07 MPa and 15.59 MPa in φ0.3 mm and φ0.4 mm, φ0.5 mm and φ0.6 mm, respectively, differences were increased with increasing of ball size. With similar reflow profile, the thickness of IMC decreased as the diameter of the ball increased. The thickness of IMC was 2.42 µm and 2.17 µm, 1.63 µm and 1.77 µm with increasing of the ball size, respectively. Originality/value Pb-free solder was gradually used to replace traditional Sn-Pb solder and has been widely used in industry. Nevertheless, some products inevitably used a mixture of Sn-Pb and Pb-free solder to make the transition from Sn-Pb to Pb-free solder. Therefore, it was very important to understand the reliability of Sn-Pb solder joint and more further research works were also needed.

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Effects of twin grain boundaries on the subgrain rotation of the solder joint during thermal shock

Cited by 12 publications

References 31 publications

Effect of grain boundary on failure behavior of SABI333 solder joints during creep

Effect of grain boundary on failure behavior of SABI333 solder joints during creep

Microstructural and mechanical evolution of sintered nano-silver joints on bare copper substrates during high-temperature storage

Property of Sn-37Pb solder bumps with different diameter during thermal shock

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