Effects of β-Sn Crystal Orientation on the Deformation Behavior of SAC305 Solder Joints

Mondal, Debabrata; Haq, Mohammad Ashraful; Suhling, Jeffrey C.; Lall, Pradeep

doi:10.1109/ectc51906.2022.00262

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) 2022

DOI: 10.1109/ectc51906.2022.00262

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Effects of β-Sn Crystal Orientation on the Deformation Behavior of SAC305 Solder Joints

Debabrata Mondal

Mohammad Ashraful Haq

Jeffrey C. Suhling

et al.

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Cited by 3 publications

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“…In the simplest case of single grain Sn-Ag-Cu solder joints, both experiments [1][2][3] and modelling 3,[7][8][9][10] have shown that the most severe thermal fatigue damage develops in single grain joints when the β-Sn c-axis lies in the plane of the printed circuit board (PCB). This has been attributed to two factors 1,2 : (1) this orientation maximises the in-plane CTE mismatch between the solder and package and, therefore, maximises in-plane shear during temperature cycling and (2) this orientation also minimises the β-Sn CTE component normal to the PCB which induces a tensile component of stress during heating.…”

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confidence: 99%

The role of microstructure in the thermal fatigue of solder joints

Xian,

Xu,

Stoyanov

et al. 2024

Nat Commun

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Thermal fatigue is a common failure mode in electronic solder joints, yet the role of microstructure is incompletely understood. Here, we quantify the evolution of microstructure and damage in Sn-3Ag-0.5Cu joints throughout a ball grid array (BGA) package using EBSD mapping of localised subgrains, recrystallisation and heavily coarsened Ag3Sn. We then interpret the results with a multi-scale modelling approach that links from a continuum model at the package/board scale through to a crystal plasticity finite element model at the microstructure scale. We measure and explain the dependence of damage evolution on (i) the β-Sn crystal orientation(s) in single and multigrain joints, and (ii) the coefficient of thermal expansion (CTE) mismatch between tin grains in cyclic twinned multigrain joints. We further explore the relative importance of the solder microstructure versus the joint location in the array. The results provide a basis for designing optimum solder joint microstructures for thermal fatigue resistance.

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confidence: 99%

The role of microstructure in the thermal fatigue of solder joints

Xian,

Xu,

Stoyanov

et al. 2024

Nat Commun

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Reliability and thermal fatigue life prediction of solder joints using nanoindentation

Cao,

Lan,

Cui

et al. 2024

Materials Today Communications

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The Reliability of SAC305 Individual Solder Joints during Creep–Fatigue Conditions at Room Temperature

et al. 2022

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The failure of one solder joint out of the hundreds of joints in a system compromises the reliability of the electronics assembly. Thermal cycling is a result of both creep–fatigue mechanisms working together. To better understand the failure process in thermal cycling, it is crucial to analyze both the effects of creep and fatigue mechanisms in a methodical manner. In this work, individual solder junctions are subjected to accelerated shear fatigue testing to investigate the effects of creep and fatigue on joint dependability at room temperature. A modified fixture is used to conduct fatigue tests on an Instron 5948 micromechanical tester. SAC305 joints with an OSP surface finish were cycled under stress control at first, and then the strain was maintained for a set amount of time. In this investigation, three stress amplitudes of 16, 20, and 24 MPa are used, together with varying residence periods of 0, 10, 60, and 180 s. The fatigue life of solder junctions is described for each testing condition using the two-parameter Weibull distribution. Additionally, as a function of stress amplitude and residence time, a dependability model is created. For each testing scenario, the progression of the stress–strain loops was studied. By quantifying relevant damage metrics, such as plastic work per cycle and plastic strain at various testing circumstances, the damage due to fatigue is distinguished from creep. To investigate the relationships between plastic work and plastic strain with fatigue life, the Coffin–Manson and Morrow Energy model is used. The results indicate that using greater stress magnitudes or longer dwell periods significantly shortens fatigue life and dramatically increases plastic work and plastic strain. The housing impact is significant; in some circumstances, testing with a longer dwelling period and lower stress amplitude resulted in more damage than testing with a shorter dwelling period and higher stress levels. When illustrating the fatigue behavior of solder junctions under various stress amplitudes or dwellings, the Coffin–Manson and Morrow Energy model were both useful. In the end, general reliability models are developed as functions of plastic work and plastic strain.

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Effects of β-Sn Crystal Orientation on the Deformation Behavior of SAC305 Solder Joints

Cited by 3 publications

References 47 publications

The role of microstructure in the thermal fatigue of solder joints

The role of microstructure in the thermal fatigue of solder joints

Reliability and thermal fatigue life prediction of solder joints using nanoindentation

The Reliability of SAC305 Individual Solder Joints during Creep–Fatigue Conditions at Room Temperature

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