2013
DOI: 10.3139/120.110432
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Einsatz der Bayes'schen Statistik in der Zuverlässigkeitsbestimmung von zerstörungsfreien Prüfsystemen

Abstract: Die Fehlerauffindwahrscheinlichkeit oder “Probability of Detection” ist zu einer wichtigen Qualitätskennzahl von zerstörungsfreien Prüfsystemen geworden. Die Einschätzung von nur künstlichen Fehlern ist jedoch als Bewertungsgrundlage meist nicht ausreichend. Die später verwendeten Prüfobjekte mit den real vorkommenden Fehlern sind die zu betrachtende Basis, für die der Endanwender eine gültige Qualitätseinschätzung der angewandten zerstörungsfreien Prüfung fordert. Jedoch ist bei dem Fall, dass die Datenmenge … Show more

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Cited by 3 publications
(4 citation statements)
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“…Weighted least squares estimation or the Bayesian approach, which were already used in radiographic POD evaluation [19] , could be used as tools for the combination. Future research should aim at finding a similar model, to cover not only holes but also notches.…”
Section: Resultsmentioning
confidence: 99%
“…Weighted least squares estimation or the Bayesian approach, which were already used in radiographic POD evaluation [19] , could be used as tools for the combination. Future research should aim at finding a similar model, to cover not only holes but also notches.…”
Section: Resultsmentioning
confidence: 99%
“…The defect appearance is strongly influenced by the form of the welding joints -depth and width [3][4][5], which are the result of the choice of operating EBW process parameters. Several nondestructive testing (NDT) methods can be applied for the estimation of the defectiveness -ultrasonic testing, radiographic testing, eddy current testing and visual testing [3], magnetic particle inspection, acoustic emission, etc. The implementation of each NDT method should be combined with determination of the probability of detection (POD) of the defects and the image quality indicators (IQI).…”
Section: Introductionmentioning
confidence: 99%
“…Different types of defects, which are formed during the deep penetration of the electron beam into the processed material(s), can be defined [3][4][5]: internal root defect, void or cavities caused by spiking. gas porosity, lack/incomplete/excess of penetration, cavities, electron beam gun discharge defects, slag inclusions, spatter, undercut/overlap, warpage, etc.…”
Section: Introductionmentioning
confidence: 99%
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