The atomic layer deposition of iridium ͑Ir͒ and iridium oxide ͑IrO 2 ͒ films was investigated using an alternating supply of ͑ethylcyclopentadienyl͒͑1,5-cyclooctadiene͒ iridium and oxygen gas at temperatures between 230 and 290°C. The phase transition between Ir and IrO 2 occurred at the critical oxygen partial pressure during the oxygen injection pulse. The oxygen partial pressure was controlled by the O 2 / ͑Ar+ O 2 ͒ ratio or deposition pressures. The resistivity of the deposited Ir and IrO 2 films was about 9 and 120 ⍀ cm, respectively. In addition, the critical oxygen partial pressure for the phase transition between Ir and IrO 2 was increased with increasing the deposition temperature. Thus, the phase of the deposited film, either Ir or IrO 2 , was controlled by the oxygen partial pressure and the deposition temperature. However, the formation of a thin Ir layer was detected between the IrO 2 and SiO 2 substrate. To remove this interfacial layer, the oxygen partial pressure is increased to a severe condition. And the impurity contents were below the detection limit of Auger electron spectroscopy in both Ir and IrO 2 films.