Electrical characterization of ALD-coated silicon dioxide micro-hemispherical shell resonators

Shao, Peng; Tavassoli, Vahid; Liu, Chang-Shun; Sorenson, Logan; Ayazi, Farrokh

doi:10.1109/memsys.2014.6765715

Cited by 17 publications

(17 citation statements)

References 7 publications

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“…The smallest as-fabricated frequency split reported for hemispherical thin SiO2 shells with no electrical tuning is 21Hz (∆fn=2/fn=2=0.26%) [9]. While thin oxide hemispherical shells can exhibit intrinsic zero frequency split between degenerate resonance modes despite thickness anisotropy [13], support anisotropy sets the minimum achievable, as-fabricated, frequency split.…”

Section: Resultsmentioning

confidence: 98%

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Highly-symmetric silicon dioxide shallow shell resonators with angstrom-level roughness

2015

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A highly-symmetric silicon dioxide shallow shell resonator with angstrom-level roughness (Ra=4.3Å) is presented. Curvature discontinuities in shallow shells, at a controlled distance from the base anchor of the shell, provide acoustic decoupling and significantly reduce the anchor contribution to the frequency split in degenerate wineglass modes as well as their damping. The Finite Element Method (FEM) simulations, performed in COMSOL 4.4, show increasing strain energy density at the vicinity of curvature discontinuities, confirming acoustic decoupling. The fabricated resonant shells are symmetric structures with largely asymmetric supports to force the anchoring stem to be the main contributor to the frequency split. ConformalImaging Vibrometer (CIV) measurement characterization indicate that the fabricated shallow shell resonators have as-born sub-Hz frequency splits (∆f/f≈60ppm), without any electrical frequency tuning, for the lowest elliptical mode shapes, while having asymmetric anchoring stems.

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Section: Resultsmentioning

confidence: 98%

“…The previously reported process [4,9] was based on rough physical etching of silicon exposed to SF6 plasma. In this current work, the physical etching has been replaced by chemical etching which results in much smoother surfaces.…”

Section: Fabricationmentioning

confidence: 99%

Highly-symmetric silicon dioxide shallow shell resonators with angstrom-level roughness

2015

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“…Primarily, two main methods are employed in fabrication of MEMS wineglass structures: (1) deposition of thin-films on pre-defined molds, (2) blow molding the device layer into a pre-defined cavities. For example, Q-factor of 19.1k have been demonstrated on poly-silicon shell structures deposited in preetched cavities [3]. Q-factors up to 24k [4] were measured on poly-diamond wineglass shells deposited in pre-etched cavities and up to 20k were measured on sputtered Ultra Low Expansion (ULE) glass shells deposited on precision ball lenses [5].…”

Section: Introductionmentioning

confidence: 99%

Demonstration of 1 Million <inline-formula> <tex-math notation="LaTeX">$Q$ </tex-math></inline-formula>-Factor on Microglassblown Wineglass Resonators With Out-of-Plane Electrostatic Transduction

Senkal

Ahamed

Ardakani

et al. 2015

J. Microelectromech. Syst.

113

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In this paper, we report Q-factor over 1 million on both n = 2 wineglass modes, and high-frequency symmetry ( f/ f ) of 132 ppm on wafer-level microglassblown 3-D fused silica wineglass resonators at a compact size of 7-mm diameter and center frequency of 105 kHz. In addition, we demonstrate for the first time, out-of-plane capacitive transduction on microelectromechanical systems wineglass resonators. High Q-factor is enabled by a high aspect ratio, self-aligned glassblown stem structure, careful surface treatment of the perimeter area, and low internal loss fused silica material. Electrostatic transduction is enabled by detecting the spatial deformation of the 3-D wineglass structure using a new out-of-plane electrode architecture. Out-of-plane electrode architecture enables the use of sacrificial layers to define the capacitive gaps and 10 μm capacitive gaps have been demonstrated on a 7-mm shell, resulting in over 9 pF of active capacitance within the device. Microglassblowing may enable batch-fabrication of high-performance fused silica wineglass gyroscopes at a significantly lower cost than their precision-machined macroscale counterparts.[ 2014-0251]Index Terms-Micro-glassblowing, 3-D MEMS, wineglass resonator, degenerate mode gyroscope, fused silica.

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“…For example, Q-factor of 19.1k have been demonstrated on poly-silicon shell structures deposited in pre-etched cavities [3]. Q-factors up to 24k [4] were measured on poly-diamond wineglass shells.…”

Section: Introductionmentioning

confidence: 99%

MEMS Micro-glassblowing Paradigm for Wafer-level Fabrication of Fused Silica Wineglass Gyroscopes

Senkal

Ahamed

Askari

et al. 2014

Procedia Engineering

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Electrical characterization of ALD-coated silicon dioxide micro-hemispherical shell resonators

Cited by 17 publications

References 7 publications

Highly-symmetric silicon dioxide shallow shell resonators with angstrom-level roughness

Highly-symmetric silicon dioxide shallow shell resonators with angstrom-level roughness

Demonstration of 1 Million <inline-formula> <tex-math notation="LaTeX">$Q$ </tex-math></inline-formula>-Factor on Microglassblown Wineglass Resonators With Out-of-Plane Electrostatic Transduction

MEMS Micro-glassblowing Paradigm for Wafer-level Fabrication of Fused Silica Wineglass Gyroscopes

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