2016
DOI: 10.1186/s11671-016-1689-x
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Electrical Contacts on Silicon Nanowires Produced by Metal-Assisted Etching: a Comparative Approach

Abstract: Silicon nanowires fabricated by metal-assisted chemical etching can present low porosity and a rough surface depending on the doping level of the original silicon wafer. In this case, wiring of silicon nanowires may represent a challenging task. We investigated two different approaches to realize the electrical contacts in order to enable electrical measurement on a rough silicon nanowire device: we compared FIB-assisted platinum deposition for the fabrication of electrical contact with EBL technique.

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Cited by 7 publications
(5 citation statements)
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“…In [17], the authors discuss as a possible explanation of this advantageous feature, the intrinsic low resistivity of FIBID-Pt and the Ga-ion induced local implantation of the NW under the Pt contact. This is consistent with the results reported on FIBID-Pt contacts on Si NWs [18], on ZnS NWs [19] and on ZnO NWs [20].The ohmic nature of Pt contacts to NWs allows to assume that the resistance measured in two-point configuration is dominated by the NW resistance and to derive an estimation of the resistivity of single NWs.…”
Section: Electrical Characterizationsupporting
confidence: 88%
“…In [17], the authors discuss as a possible explanation of this advantageous feature, the intrinsic low resistivity of FIBID-Pt and the Ga-ion induced local implantation of the NW under the Pt contact. This is consistent with the results reported on FIBID-Pt contacts on Si NWs [18], on ZnS NWs [19] and on ZnO NWs [20].The ohmic nature of Pt contacts to NWs allows to assume that the resistance measured in two-point configuration is dominated by the NW resistance and to derive an estimation of the resistivity of single NWs.…”
Section: Electrical Characterizationsupporting
confidence: 88%
“…In this study, smaller-diameter Si NWs were synthesized by a metal-assisted chemical etching (MCE) method. , Figure a illustrates the stepwise fabrication process of Si NWs. To precisely control the diameter of the Si NWs, polystyrene (PS) spheres with uniform diameter were packed on the substrate surface, as shown by the SEM image (Figure S1a).…”
Section: Resultsmentioning
confidence: 99%
“…Single Cu x O NW-based devices were realized by means of a combination of laser lithography, metal evaporation, and electron beam lithography (EBL), following the procedure adopted in previous works [39][40][41]. For this purpose, a commercial silicon substrate with 1 µm of thermal oxide was used to electrically characterize the NWs.…”
Section: Single-nw-based Device Fabricationmentioning
confidence: 99%
“…A micrometric mask of Ti/Au (5 nm, 200 nm) was then designed through Heidelberg µpg101 (Heidelberg Instruments Mikrotechnik GmbH, Heidelberg, Germany), a laser lithography system, and RF sputtering in Ar plasma (around 5 × 10 −3 mbar). The Cu x O NWs were transferred from the original substrate to the central part of the pre-patterned substrate, with the help of a scratching tool, near the Ti/Au tracks [41]. The NWs were randomly spread on the new substrate; therefore, their exact position was determined through FESEM.…”
Section: Single-nw-based Device Fabricationmentioning
confidence: 99%