2008
DOI: 10.1016/j.tsf.2007.08.052
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Electrical, mechanical, and optical properties of the organic–inorganic hybrid-polymer thin films deposited by PECVD

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Cited by 23 publications
(11 citation statements)
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“…However, the applications of the technique have been limited to fields except electronic and photonic devices. For example, the technique to fabricate low‐ k materials (i.e., dielectric materials) has been investigated for minimization of the signal delay in a silicon chip [2] and as protective films for chemical resistance and strong adherence because of the rich cross‐links [3]. The reason, as is generally recognized, is that plasma polymerization is too complex to control the molecular structure.…”
Section: Introductionmentioning
confidence: 99%
“…However, the applications of the technique have been limited to fields except electronic and photonic devices. For example, the technique to fabricate low‐ k materials (i.e., dielectric materials) has been investigated for minimization of the signal delay in a silicon chip [2] and as protective films for chemical resistance and strong adherence because of the rich cross‐links [3]. The reason, as is generally recognized, is that plasma polymerization is too complex to control the molecular structure.…”
Section: Introductionmentioning
confidence: 99%
“…Organosilicon thin films, obtained by plasma polymerization in plasma-enhanced chemical vapor deposition (PECVD) systems from precursors containing silicon, are well-known for their wide range of modern technological applications, such as corrosion protective coatings, [1][2][3][4][5] humidity and gas sensing, [6][7][8] hydrophobic layers, 9,10 hard coatings, 11,12 and optical/electrical interlayers. [13][14][15] Hexamethyldisiloxane (HMDSO) is among the frequently used precursors because of its nontoxicity and its relatively low cost. 16 Plasma treatment, depending on the gas type, experimental conditions, and final desired properties, is well established to treat different materials surfaces (polymer, silica, metal oxide, semiconductor, etc).…”
Section: Introductionmentioning
confidence: 99%
“…Organosilicon thin films, obtained by plasma polymerization in plasma‐enhanced chemical vapor deposition (PECVD) systems from precursors containing silicon, are well‐known for their wide range of modern technological applications, such as corrosion protective coatings, humidity and gas sensing, hydrophobic layers, hard coatings, and optical/electrical interlayers . Hexamethyldisiloxane (HMDSO) is among the frequently used precursors because of its nontoxicity and its relatively low cost …”
Section: Introductionmentioning
confidence: 99%
“…A number of studies have been conducted in this area. The candidate materials include polynitriles , polyimides , benzocyclobutene resins , poly(binaphthylene ether) , polyquinolines , polynorbornenes , poly(vinylidene fluoride) , and organic–inorganic hybrid polymers .…”
Section: Introductionmentioning
confidence: 99%