“…Moreover, in the short term, lithographic patterning is expected to be avoided by the industry at the nanometer scale. In that context, few silicon based bottom-up techniques have been investigated: annealing of a thin silicon layer deposited onto an insulator [10][11][12], low pressure chemical vapour deposition (LPCVD) of silicon clusters onto an insulator layer [13][14][15], aerosol synthesis [6,22] and thermal demixtion of a silicon rich oxide (SRO) layer. SRO may be obtained by low energy 28 Si + ions into a thermal oxide layer [16][17][18] or by CVD (chemical vapor deposition) with such parameters that a SiO X<2 layer is elaborated [19,20].…”