2016 International Symposium on VLSI Design, Automation and Test (VLSI-DAT) 2016
DOI: 10.1109/vlsi-dat.2016.7482540
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Electrical/thermal co-design and co-simulation, from chip, package, board to system

Abstract: It has been well known for years that as the critical feature size within a chip keeps shrinking, design and optimization among power, heat and performance would become even challenging. On one hand, the electrical functionalities of the devices are closely coupled with temperature and power distributions. On the other hand, the devices within the chip are not totally isolated and confined-the connection and interaction with the environments such as the package, board, and enclosure cannot be ignored especiall… Show more

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