“…Electroplating of gold can be performed from a variety of aqueous solutions containing a variety of additives that are known to have various influences on the deposited metal layer (see, for example, Cheh and Sard, 1971;Bindra et al, 1989), as well as the electro-chemical properties of the solution. In general, the aqueous solution contains excess inert electrolyte such as potassium and citrate ions, which do not take part in the reaction at either electrode, but do migrate within the electric field and thereby act to carry the majority of current within the bulk of the solution.…”