2002
DOI: 10.1016/s0013-4686(01)00883-0
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Electrochemical and thermal behavior of copper coated type MAG-20 natural graphite

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Cited by 30 publications
(13 citation statements)
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“…It resulted in superior electrochemical properties of the material, such as an increased electric conductivity and therefore improved high rate capability [20,21]. It was noted that possible reasons for the observed improvements are the suppression of solvent cointercalation and an improved lithium ion charge transfer at the graphite/electrolyte interface [19].…”
Section: Introductionmentioning
confidence: 99%
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“…It resulted in superior electrochemical properties of the material, such as an increased electric conductivity and therefore improved high rate capability [20,21]. It was noted that possible reasons for the observed improvements are the suppression of solvent cointercalation and an improved lithium ion charge transfer at the graphite/electrolyte interface [19].…”
Section: Introductionmentioning
confidence: 99%
“…The major drawbacks of the reported coating methods are their high costs, the complexity of the processes, the usage of harmful chemicals (e.g. formaldehyde) and the influence of obtained byproducts [19,20]. Due to the disadvantages mentioned above copper coatings are, to our knowledge, not yet applied in commercial applications.…”
Section: Introductionmentioning
confidence: 99%
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“…Several studies concerning copper deposition processes have been reported, such as, photoelectrodeposition [13], sputtering [14], electrodeposition [15], PVD-processes [16] wetness technique [17] and electroless deposition [18]. Among these methods, electrochemical deposition offers good filling capability, low-cost, and it is a fast alternative process to produce copper particle modified electrode.…”
Section: Introductionmentioning
confidence: 99%
“…It is anticipated that the 4 wetting problem could be overcome by coating the carbon nanofibre with copper before the consolidation process. Different coating techniques can be used, such as sputtering [16], electrodeposition [17,18], wetness technique [19], but the method of choice for metallization and interconnection which has emerged in recent years is electroless deposition due to its low cost, fast deposition rate, good filling capability, good uniformity and low process temperatures [20][21][22][23]. The deposition of Cr interlayers onto the CNF before Cu deposition has also been explored with the objective of improving the adhesion of Cu on CNF.…”
mentioning
confidence: 99%