Electrochemical deposition of Cu and Ni/Cu multilayers in Si Microsystem Technologies

Serre, C.; Yaakoubi, Nourdin; Martı́nez, S.; Pérez-Rodrı́guez, A.; Morante, J.R.; Estéve, J.; Montserrat, J.

doi:10.1016/j.sna.2005.04.022

Cited by 22 publications

(12 citation statements)

References 9 publications

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“…Also, thin Ni/Cu multilayer film is technologically interesting system that attracted great attention owing to high mechanical strength, high wear and corosion resistance and giant magnetoresistance behaviour [7][8][9][10][11].…”

Section: Introductionmentioning

confidence: 99%

Indentation behaviour of 'soft film on hard substrate' composite system type

Lamovec¹,

Jović²,

Mladenović³

et al. 2015

Zas Mat

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Section: Introductionmentioning

confidence: 99%

Indentation behaviour of 'soft film on hard substrate' composite system type

Lamovec¹,

Jović²,

Mladenović³

et al. 2015

Zas Mat

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“…In recent years, more metals have been investigated for MEMS due to their excellent electrical and thermal conductivity and mechanical and magnetic properties [1][2][3][4][5][6]. However, up to now metallic MEMS components that have been fabricated are mainly nickel and copper with simple structures since the main micromachining technology is based on LIGA (an acronym from German words for lithography, electroforming, and molding) [7,8] that can be applied to fabricate high-aspect-ratio bulk microstructure for Ni and Cu [9,10].…”

Section: Introductionmentioning

confidence: 99%

A potential method for electrochemical micromachining of titanium alloy Ti6Al4V

Jiang

Attia

et al. 2008

J Appl Electrochem

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The micromachining of complex three-dimensional microstructures (bulk micromachining) on metals can be applied to fabricate many novel devices for micro electromechanical system (MEMS), which will greatly benefit the development of MEMS. In this paper, a new electrochemical micromachining method named the confined etchant layer technique (CELT) was explored on the micromachining of the titanium alloy. Micro-scale trapezoidal slots were replicated on titanium alloy by using a mold with the corresponding negative microstructures (trapezoidal teeth). The machining resolution reached 0.503 mu m. The electrochemical mechanisms involved in the process are analyzed and the parameters that influenced the machining resolution are discussed

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“…EC deposition of Cu has already been proposed for the development of advanced inductive devices and microsystems [13,14]. In principle, Cu is well suited for microsystem applications in Si technology, owing to its low resistivity, low cost and ease to grow electrochemically in a well-controlled way.…”

Section: Introductionmentioning

confidence: 99%