2008
DOI: 10.1016/j.jelechem.2008.04.011
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Optimisation of copper electrodeposition processes for Si technology based inductive microsystems

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Cited by 7 publications
(2 citation statements)
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“…This has been heightened yet more by the massive use of copper in the electronics industry [1][2][3][4].…”
Section: Introductionmentioning
confidence: 99%
“…This has been heightened yet more by the massive use of copper in the electronics industry [1][2][3][4].…”
Section: Introductionmentioning
confidence: 99%
“…Taking this into account, the electromagnetic converter has been fabricated by combining standard microsystems technology processes, with electroplating post-processes for the fabrication of coils with thick Cu metal tracks by electrochemical (EC) deposition. This has also involved an optimization of the EC growth conditions (Cortés et al 2008) to minimize residual stress in the Cu layers and to optimize their adherence, since these are critical parameters that can compromise the viability and lifetime of the devices. The nucleus of the coil is slightly larger (8 9 8 mm 2 ) than the size of the magnet in order to avoid potential collisions of the magnet with the edges of the coil nucleus.…”
Section: Design Of the Microgenerator Prototypementioning
confidence: 99%