1975
DOI: 10.1007/bf00625961
|View full text |Cite
|
Sign up to set email alerts
|

Electrochemical studies on gold electrodes in acidic solutions of thiourea containing gold (I) thiourea complex ions

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
2
1

Citation Types

1
30
0
6

Year Published

1975
1975
2005
2005

Publication Types

Select...
7

Relationship

1
6

Authors

Journals

citations
Cited by 64 publications
(37 citation statements)
references
References 6 publications
1
30
0
6
Order By: Relevance
“…Some larger organic compounds are known to selectively form an adsorbed protective layer on the metal surface during deposition and thereby suppress vertical growth and enhance the chance of obtaining smooth thin layers of the deposited metal [10]. A small molecule such as thiourea (TU) induces a similar enhanced quality of electrodeposited copper when utilized as an additive to the plating bath [8,9,[11][12][13]. The mechanism is, however, less straightforward and involves not only the expected formation of an adsorbed TU-metal layer, but also the influence of redox and complexation reactions [12,13].…”
Section: Introductionmentioning
confidence: 99%
See 1 more Smart Citation
“…Some larger organic compounds are known to selectively form an adsorbed protective layer on the metal surface during deposition and thereby suppress vertical growth and enhance the chance of obtaining smooth thin layers of the deposited metal [10]. A small molecule such as thiourea (TU) induces a similar enhanced quality of electrodeposited copper when utilized as an additive to the plating bath [8,9,[11][12][13]. The mechanism is, however, less straightforward and involves not only the expected formation of an adsorbed TU-metal layer, but also the influence of redox and complexation reactions [12,13].…”
Section: Introductionmentioning
confidence: 99%
“…A small molecule such as thiourea (TU) induces a similar enhanced quality of electrodeposited copper when utilized as an additive to the plating bath [8,9,[11][12][13]. The mechanism is, however, less straightforward and involves not only the expected formation of an adsorbed TU-metal layer, but also the influence of redox and complexation reactions [12,13]. Arvia and co-workers have explored such interactions between TU and a series of metals including copper [14,15], silver [16], and gold [17].…”
Section: Introductionmentioning
confidence: 99%
“…Hence, the gold electrode surface is positive in a potential range studied. Positively charged complex species [((NH 2 ) 2 C=S) 2 Au , which are formed by reaction (6) in a potential range of the first peak, should desorb according to reaction (7) and pass inside the electrical double layer, where they interact with (NH 2 ) 2 C=S molecules by reaction (8) Such a behavior of gold electrodes during the corrosion dissolution in acidic TCA solutions was attributed [1,2] to the adsorption of TCA molecules on gold and their hydrolysis to yield hydrosulfides and sulfides (AuHS -and Au 2 S), which results in the formation of adsorption layers on the gold surface.…”
Section: Resultsmentioning
confidence: 99%
“…Processing the data of [7] on the anodic dissolution of gold from a rotating disk electrode (300 rpm) in sulfuric acid solutions of TCA (0.001-0.1 TCA, 0.1 M H 2 SO 4 ) at 303 K gave the reaction order in TCA n = 1.69-1.74 (Fig. 2b, curve 3).…”
Section: Resultsmentioning
confidence: 99%
See 1 more Smart Citation