“…A small molecule such as thiourea (TU) induces a similar enhanced quality of electrodeposited copper when utilized as an additive to the plating bath [8,9,[11][12][13]. The mechanism is, however, less straightforward and involves not only the expected formation of an adsorbed TU-metal layer, but also the influence of redox and complexation reactions [12,13]. Arvia and co-workers have explored such interactions between TU and a series of metals including copper [14,15], silver [16], and gold [17].…”