Electrodeposition of copper in the presence of 2-mercaptoethanol

Sarma, R. Lekshmana; Nageswar, S.

doi:10.1016/0376-4583(81)90031-5

Cited by 5 publications

(1 citation statement)

References 7 publications

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“…3 However, plating baths that contain more classes of additives may increase the resistivity of copper films 4 and increase the complexity of annealing processing. Organic additives added to copper electroplating baths can generally be categorized into accelerators, suppressors, and levelers.…”

Section: Introductionmentioning

confidence: 99%

Leveling effects of copper electrolytes with hybrid-mode additives

Lin

Shieh

Chang

et al. 2002

Journal of Vacuum Science &Amp; Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena

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100 nm vias were completely filled with copper for interconnect applications using an electrolyte in the presence of polyethylene glycols ͑PEG͒ and a hybrid-mode additive, benzotriazole ͑BTA͒. Electrochemical analyses indicated that BTA with a higher concentration inhibited the copper deposition rate, whereas BTA with a lower concentration accelerated the copper deposition rate. This electrolyte thus generated an enhanced deposition gradient within a gap because the PEG molecules and the high concentration of BTA, adsorbed at the opening of the gap, inhibited the deposition. Meanwhile, a little BTA diffused into the inner part of the gap and thus accelerated the deposition of copper. Therefore, this two-component ͑PEG and BTA͒ additive electrolyte had the capacity of a three-additive bath ͑accelerators, suppressors, and levelers͒.

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Section: Introductionmentioning

confidence: 99%