Assembly of microdevices
from constituent parts currently relies on slow serial steps via direct
assembly processes such as pick-and-place operations. Template Electrokinetic
Assembly (TEA), a guided, noncontact assembly process, is presented
in this work as a promising alternative to serial assembly processes.
To characterize the process and its implementation of electrokinetic,
dielectrophoretic, and electro-osmotic phenomena, we conducted studies
to examine the assembly of polymer microparticles at specific locations
on glassy carbon interdigitated electrode arrays (IDEAs). The IDEAs
are coated with a layer of lithographically patterned resist, so that
when an AC electric field is applied to the IDEA, microparticles suspended
in the aqueous solution are attracted to the open regions of the electrodes
not covered by photoresist. Interplay between AC electro-osmosis and
dielectrophoretic forces guides 1 and 5 μm diameter polystyrene
beads to assemble in regions, or “wells”, uncovered
by photoresist atop the electrodes. It was discovered that AC electro-osmosis
under an applied frequency of 1 kHz is sufficient to effectively agglomerate
1 μm beads in the wells, whereas a stepwise process involving
the application of a 1 MHz signal, followed by a 1 kHz signal, is
required for the positioning of 5 μm beads, which are mainly
affected by dielectrophoretic forces. Permanent entrapment of the
microparticles is then demonstrated via the electropolymerization
process of the conducting polymer polypyrrole.