2013
DOI: 10.1149/2.039312jes
|View full text |Cite
|
Sign up to set email alerts
|

Electroless Copper Deposition Using Sn/Ag Catalyst on Epoxy Laminates

Abstract: Electroless copper deposition was investigated on epoxy laminate substrates (Isola 185HR) using a silver-based catalyst, and a nonroughening surface treatment method based on sulfuric acid. The current challenges in electroless copper deposition include (i) high cost of Pd-based catalysts, (ii) deterioration of electrical performance of deposited metal at high frequency due to electron scattering at the roughened surface, and (iii) limited adhesion strength of electroless layers to substrates. We investigated … Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
2

Citation Types

2
13
0

Year Published

2014
2014
2024
2024

Publication Types

Select...
5

Relationship

0
5

Authors

Journals

citations
Cited by 21 publications
(15 citation statements)
references
References 59 publications
2
13
0
Order By: Relevance
“…We note that the Cu deposition rate reaches the same value of 15–20 µg/cm 2 /min on these three surfaces after approximately 120 min (Figure ). The deposited copper amounts and the deposition rates are comparable with those found in the literature on polymers . The relative poor reactivity of Cu incorporated LCP compared with Pd and Ni incorporated LCP for electroless Cu deposition, would arise from the catalyst.…”
Section: Resultssupporting
confidence: 78%
See 3 more Smart Citations
“…We note that the Cu deposition rate reaches the same value of 15–20 µg/cm 2 /min on these three surfaces after approximately 120 min (Figure ). The deposited copper amounts and the deposition rates are comparable with those found in the literature on polymers . The relative poor reactivity of Cu incorporated LCP compared with Pd and Ni incorporated LCP for electroless Cu deposition, would arise from the catalyst.…”
Section: Resultssupporting
confidence: 78%
“…The partial anodic and cathodic reactions also have several substeps which depend on the experimental conditions as well as the used catalytic metals . The rate determining step of electroless Cu deposition is frequently associated with the anodic process, that is, the oxidation of formaldehyde whereas the cathodic reaction is the reduction of Cu 2+ ions into the metallic Cu. The electroless Cu deposition process including the anodic and cathodic half reactions, when formaldehyde used as the reducing agent has been largely detailed in the past .…”
Section: Resultsmentioning
confidence: 99%
See 2 more Smart Citations
“…These additional SBU layers include microvias and very fine copper lines and can be situated on both sides of the PCB core [2]. The rapid evolution of microelectronics industry translates itself into a need for higher density substrates with smaller features [3][4][5]. In order to fulfill these requirements, the roughness treatment of dielectric materials (mostly epoxies) has to be limited for two reasons.…”
Section: Introductionmentioning
confidence: 99%